UNIVERSAL WAFER CARRIER FOR WAFER LEVEL DIE BURN-IN
First Claim
1. A fixture for testing a wafer of semiconductor dice comprising:
- a first rigid support member for receiving the semiconductor dice in wafer form, the first rigid support member having a plurality of contact members thereon, the plurality of contact members including a plurality of contact tips including at least one contact area for mating with a plurality of bumps on the wafer and a plurality of bump for establishing communication with test circuitry connected to the fixture.
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Accused Products
Abstract
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.
56 Citations
41 Claims
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1. A fixture for testing a wafer of semiconductor dice comprising:
a first rigid support member for receiving the semiconductor dice in wafer form, the first rigid support member having a plurality of contact members thereon, the plurality of contact members including a plurality of contact tips including at least one contact area for mating with a plurality of bumps on the wafer and a plurality of bump for establishing communication with test circuitry connected to the fixture. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 34)
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17. A flexible plate comprising:
a flexible substrate having conductive patterns therein for contacting a contact pad of a semiconductor die and a contact member of another substrate for connecting the semiconductor die to another device. - View Dependent Claims (18, 19, 20)
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21. A fixture for operations for a wafer of semiconductor dice comprising:
a first rigid support member for receiving a plurality of semiconductor dice in wafer form, the first rigid support member having a first contact member located on one side thereof, a second contact member located on another side of the first rigid support member connected to the first contact member, the second contact member for mating with a bump on the wafer for a second support member to engage the first rigid support member to retain the semiconductor dice in wafer form in contact with the first rigid support member, one of the first rigid support member and the second support member including a single cavity for retaining the semiconductor dice in wafer form therein. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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35. A fixture for operations for a wafer of semiconductor dice comprising:
a first rigid support member for receiving semiconductor dice in wafer form, the first rigid support member having a first contact member located on one side thereof, a second contact member located on another side of the first rigid support member connected to the first contact member, the second contact member for mating with a contact location on the wafer for a second support member to engage the first rigid support member to retain the semiconductor dice in wafer form in contact with the first rigid support member, one of the first rigid support member and the second support member including a single cavity for retaining the semiconductor dice in wafer form therein. - View Dependent Claims (36)
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37. A method for performing an operation on a wafer having two opposing surfaces using a first plate which includes a biasing mechanism, and a second rigid plate selectively engageable with the first plate, the second rigid plate having a plurality of contact elements extending therefrom and having a cavity for receiving the uncut wafer therein, the wafer having semiconductor dice thereon and at least one interconnect between at least two circuits on the wafer, the method comprising:
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placing the wafer between the first plate and the second rigid plate with the plurality of contact elements on the second rigid plate engaging corresponding locations on the wafer, at least one contact element for contacting at least a portion of the interconnect between at least two circuits on the wafer for reducing the number of contact elements on the second rigid plate for contacting the plurality of semiconductor dice on the wafer; and
biasing the plurality of contact elements of the second rigid plate against a surface of the wafer by applying a force to an opposing surface of the wafer to form contact with the first plate, the force caused by the biasing mechanism, and the force applied to substantially the entirety of the opposing surface. - View Dependent Claims (38, 39, 40, 41)
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Specification