SYSTEM ON PACKAGE OF A MOBILE RFID INTERROGATOR
First Claim
1. A system on package (SOP) of a mobile radio frequency identification (RFID) interrogator, comprising:
- a substrate having external connection terminal patterns on a first surface and circuit wiring patterns on a second surface;
a high frequency front-end part mounted on the second surface and configured to transmit and receive a RFID signal;
a power amplifier IC mounted on the second surface and configured to output an amplified high frequency transmission signal to the high frequency front-end part;
an analog-digital signal processing chip mounted on the second surface and configured to output a high frequency transmission signal to the power amplifier IC, and process the RFID signal received through the high frequency front-end part; and
a mold resin configured to cover the second surface and components is mounted on the second surface for electrical insulation of the components from outside and physical protection of the components from outside.
1 Assignment
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Accused Products
Abstract
The present invention is to implement a SOP of a mobile RFID interrogator. The substrate has external connection terminal patterns on a first surface of a substrate and circuit wiring patterns on a second surface of the substrate. a high frequency front-end part, a power amplifier IC, an analog-digital signal processing chip and the like are mounted on the second surface. The high frequency front-end part is to transmit and receive a RFID signal. The power amplifier IC is to output an amplified high frequency transmission signal to the high frequency front-end part. The analog-digital signal processing chip is to output a high frequency transmission signal to the power amplifier IC and process the RFID signal received through the high frequency front-end part, a mold resin is to cover the second surface and components mounted on the second surface for electrical insulation from outside and physical protection from outside.
11 Citations
6 Claims
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1. A system on package (SOP) of a mobile radio frequency identification (RFID) interrogator, comprising:
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a substrate having external connection terminal patterns on a first surface and circuit wiring patterns on a second surface; a high frequency front-end part mounted on the second surface and configured to transmit and receive a RFID signal; a power amplifier IC mounted on the second surface and configured to output an amplified high frequency transmission signal to the high frequency front-end part; an analog-digital signal processing chip mounted on the second surface and configured to output a high frequency transmission signal to the power amplifier IC, and process the RFID signal received through the high frequency front-end part; and a mold resin configured to cover the second surface and components is mounted on the second surface for electrical insulation of the components from outside and physical protection of the components from outside. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification