Yokeless Hidden Hinge Digital Micromirror Device

• US 20070285757A1
• Filed: 08/06/2007
• Published: 12/13/2007
• Est. Priority Date: 11/21/2001
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: DiCarlo, Anthony, Mezenner, Rabah, Huffman, James, Knipe, Richard, Oden, Patrick
• Granted Patent: US 7,654,677 B2
• Time in Patent Office: Days
• US Class Current: 359/224.100
• CPC Class Codes: B81B 3/0035 Constitution or structural means for controlling the movement of the flexible or deformable elements
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: Y10T 428/22 Nonparticulate element embedded or inlaid in substrate and visible

Abstract

A micromirror array 110 fabricated on a semiconductor substrate 11. The array 110 is comprised of three operating layers 12, 13, 14. An addressing layer 12 is fabricated on the substrate. A hinge layer 13 is spaced above the addressing layer 12 by an air gap. A mirror layer 14 is spaced over the hinge layer 13 by a second air gap. The hinge layer 13 has a hinge 13a under and attached to the mirror 14a, the hinge 13a permitting the mirror 14a to tilt. The hinge layer 13 further has spring tips 13c under the mirror 14a, which are attached to the addressing layer 12. These spring tips 13c provide a stationary landing surface for the mirror 14a.

Claims

1-23. -23. (canceled)

24. A micromechanical device comprising:

a substrate;

a hinge member spaced apart from said substrate;

an electrode spaced apart from said substrate; and

a contact point spaced apart from said substrate, wherein said electrode is closer to said hinge member than said contact point.

25. The micromechanical device of claim 24 comprising a deflectable member operable to contact said contact point upon defection of said deflectable member.

26. The micromechanical device of claim 24, said contact point and said deformable member formed from a common layer.

27. The micromechanical device of claim 24, said hinge member and said deformable member formed from a common layer.

28. The micromechanical device of claim 24, said electrode and said deformable member formed from a common layer.

29. The micromechanical device of claim 24, wherein said electrode is operable to attract said deflectable member.

30. The micromechanical device of claim 24, wherein the deflectable member is a micromirror.

31. The micromechanical device of claim 24, wherein the device is a micromirror array.

32. A method of forming a micromirror device, the method comprising:

providing a substrate;

forming a hinge member spaced apart from said substrate

forming an electrode spaced apart from said substrate; and

forming a contact point spaced apart from said substrate, wherein said electrode is closer to said hinge member than said contact point.

33. The method of claim 32 comprising forming a deflectable member operable to contact said contact point upon defection of said deflectable member.

34. The method of claim 32 comprising forming said contact point and said deformable member from a common layer.

35. The method of claim 32 comprising forming said hinge member and said deformable member from a common layer.

36. The method of claim 32 comprising forming said electrode and said deformable member from a common layer.

37. The method of claim 32 comprising forming said electrode operable to attract said deflectable member.

38. The method of claim 32 wherein forming said deflectable member comprises forming a micromirror.