Heat-dissipating module

• US 20070285930A1
• Filed: 08/28/2006
• Published: 12/13/2007
• Est. Priority Date: 06/12/2006
• Status: Abandoned Application

• Current Assignee: Grand-Tek Technology Co., Ltd.
• Original Assignee: Grand-Tek Technology Co., Ltd.
• Inventors: Chen, Hai-Han
• Application Number:
  US11/510,746
• Publication Number:
  US 20070285930A1
• Time in Patent Office: Days
• US Class Current: 362/373
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 15/015 Devices for covering joints between adjacent lighting devices; End coverings
• CPC Class Codes: F21V 17/16 by deformation of parts; Snap action mounting
• CPC Class Codes: F21V 19/0045 by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat-dissipating module is applicable in a light-emitting device for dissipating heat of light-emitting elements in the light-emitting device. The heat-dissipating module has a heat-dissipating base located in the light-emitting device, a printed circuit board disposed on the heat-dissipating base for receiving the plurality of light-emitting elements and power lines through the heat-dissipating base and electrically connected to the printed circuit board, allowing heat-and-electricity separation, thereby improving reliability and solving the shortcomings of the prior art.

Claims

1. A heat-dissipating module applied in a light-emitting device for dissipating heat of a plurality light-emitting elements in the light-emitting device, comprising:

a heat-dissipating base disposed in the light-emitting device;

a printed circuit board disposed on the heat-dissipating base for receiving the plurality of light-emitting elements; and

power lines formed through the heat-dissipating base and electrically connected to the printed circuit board, allowing heat-and-electricity separation, thereby improving reliability.

2. The heat-dissipating module of claim 1, wherein the heat-dissipating base is a metallic heat-dissipating base.

3. The heat-dissipating module of claim 1, wherein a groove is disposed on a face of the heat-dissipating base for receiving the printed circuit board.

4. The heat-dissipating module of claim 3, wherein a wave structure is disposed on the other face of the heat-dissipating base.

5. The heat-dissipating module of claim 1, further comprising an adhesive gel for fixing the light-emitting elements on the heat-dissipating base.

6. The heat-dissipating module of claim 5, wherein the adhesive gel is one of a silver gel and insulating gel.

7. The heat-dissipating module of claim 1, further comprising gold wires for electrically connecting the printed circuit board and the light-emitting elements.

8. The heat-dissipating module of claim 1, wherein the printed circuit board comprises a plurality of receiving portions.

9. The heat-dissipating module of claim 8, wherein the receiving portions are circular holes in a square matrix.

10. The heat-dissipating module of claim 8, further comprising an epoxy resin filled in the receiving portions for covering the light-emitting elements.