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METHODS OF FORMING SOLDER CONNECTIONS AND STRUCTURE THEREOF

  • US 20070287278A1
  • Filed: 06/08/2006
  • Published: 12/13/2007
  • Est. Priority Date: 06/08/2006
  • Status: Active Grant
First Claim
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1. A method comprising:

  • depositing a first metal containing layer into a trench structure, which contacts a metalized area of a semiconductor structure;

    patterning at least one opening, in a resist, to the first metal containing layer, the opening being in substantial alignment with the trench structure;

    forming at least a pad metal containing layer or bilayer within the at least one opening;

    stripping the resist and etching the first metal layer underlying the resist; and

    flowing solder material within the trench structure and on the pad metal containing layer.

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