Method and System for Failure Signal Detention Analysis
First Claim
1. A method for analyzing a sample of wafers, comprising the steps of:
- (a) identifying F failure metrics that are applicable to at least one circuit pattern on each wafer within the sample of wafers, where F is an integer;
(b) identifying Z spatial and/or reticle zones on each wafer, where Z is an integer;
(c) providing values for each of the F failure metrics, for each of the Z zones on each wafer;
(d) defining a point for each respective wafer in an N-dimensional space, where N=F*Z, and each point has coordinates corresponding to values of the F failure metrics in each of the Z zones of the corresponding wafer; and
(e) clustering the sample of wafers into a plurality of clusters of wafers, so that the wafers within each cluster are close to each other in the N-dimensional space, thereby identifying the plurality of clusters of wafers from the sample of wafers so that within each individual cluster, the wafers have a similar distribution of defects.
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Abstract
A method for analyzing a sample of wafers includes identifying F failure metrics applicable to at least one pattern on each wafer within the sample. Z spatial and/or reticle zones are identified on each wafer, where Z and F are integers. Values are provided for each failure metric, for each zone on each wafer. A point is defined for each respective wafer in an N-dimensional space, where N=F*Z, and each point has coordinates corresponding to values of the F failure metrics in each of the zones of the corresponding wafer. The sample of wafers is partitioned into a plurality of clusters, so that the wafers within each clusters are close to each other in the N-dimensional space. A plurality of clusters is thus identified from the sample of wafers so that within each individual cluster, the wafers have similar defects to each other.
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Citations
16 Claims
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1. A method for analyzing a sample of wafers, comprising the steps of:
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(a) identifying F failure metrics that are applicable to at least one circuit pattern on each wafer within the sample of wafers, where F is an integer;
(b) identifying Z spatial and/or reticle zones on each wafer, where Z is an integer;
(c) providing values for each of the F failure metrics, for each of the Z zones on each wafer;
(d) defining a point for each respective wafer in an N-dimensional space, where N=F*Z, and each point has coordinates corresponding to values of the F failure metrics in each of the Z zones of the corresponding wafer; and
(e) clustering the sample of wafers into a plurality of clusters of wafers, so that the wafers within each cluster are close to each other in the N-dimensional space, thereby identifying the plurality of clusters of wafers from the sample of wafers so that within each individual cluster, the wafers have a similar distribution of defects. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification