Large Area Sputtering Target
First Claim
1. A sputtering target, comprising:
- a backing plate; and
a plurality of sputtering target tiles, wherein a gap is present between adjacent sputtering target tiles, and wherein the gaps are filled with material that has been plasma sprayed into at least one gap.
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Accused Products
Abstract
A sputtering target forming method, a sputtering target, and a method of using a sputtering target are herein disclosed. Large area sputtering targets are necessary for producing films on large area substrates. To save on material costs, the large area sputtering target can be formed of multiple target tiles that can be placed adjacent each other on a backing plate. The gaps that are present between the target tiles may to be filled to ensure that the backing plate does not sputter and contaminate the sputtering process. The material filling the gaps may be of the same composition as the sputtering target tiles. Alternatively, the entire sputtering target can be plasma sprayed onto the backing plate to ensure that the sputtering target has a unitary sputtering target body across the entire large area backing plate.
83 Citations
25 Claims
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1. A sputtering target, comprising:
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a backing plate; and a plurality of sputtering target tiles, wherein a gap is present between adjacent sputtering target tiles, and wherein the gaps are filled with material that has been plasma sprayed into at least one gap. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A sputtering target, comprising:
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a backing plate; and a plurality of sputtering target tiles, wherein a gap is present between adjacent sputtering target tiles, and wherein at least one gap is filled with wire that has been e-beam profiled into the gaps. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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20. A sputtering target, comprising:
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a backing plate; and a unitary sputtering target surface that has been plasma sprayed onto the backing plate. - View Dependent Claims (21, 22)
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23. A sputtering target, comprising:
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a backing plate; and a unitary sputtering target surface that comprises a plurality of wires e-beam profiled to the backing plate. - View Dependent Claims (24, 25)
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Specification