Embedded electronic device and method for manufacturing an embedded electronic device
First Claim
Patent Images
1. An embedded electronic device comprising:
- a printed circuit board, having a top surface and a bottom surface, wherein a plurality of standoffs are attached to the bottom surface;
a plurality of circuit components attached to the top surface of the printed circuit board;
a bottom overlay attached to the bottom surface of the printed circuit board;
a top overlay positioned above the top surface of the printed circuit board; and
a core layer positioned between the top surface of the printed circuit board and the top overlay and further positioned between the bottom surface of the printed circuit board and the bottom overlay.
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Abstract
An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay.
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Citations
20 Claims
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1. An embedded electronic device comprising:
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a printed circuit board, having a top surface and a bottom surface, wherein a plurality of standoffs are attached to the bottom surface; a plurality of circuit components attached to the top surface of the printed circuit board; a bottom overlay attached to the bottom surface of the printed circuit board; a top overlay positioned above the top surface of the printed circuit board; and a core layer positioned between the top surface of the printed circuit board and the top overlay and further positioned between the bottom surface of the printed circuit board and the bottom overlay. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for manufacturing an embedded electronic device, comprising:
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providing a printed circuit board having a top surface and a bottom surface, wherein a plurality of standoffs are attached to the bottom surface; affixing a plurality of circuit components onto the top surface of the printed circuit board; affixing the bottom surface of the printed circuit board to a bottom overlay using a pressure sensitive adhesive tape or a spray-on adhesive; loading the printed circuit board and bottom overlay into an injection molding apparatus; loading a top overlay positioned above a top surface of the printed circuit board into the injection molding apparatus; injecting thermosetting polymeric material between the top surface of the printed circuit board, the plurality of circuit components and the top overlay; and injecting thermosetting polymeric material between the bottom surface of the printed circuit board and the bottom overlay. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification