Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements

• US 20070290217A1
• Filed: 06/16/2006
• Published: 12/20/2007
• Est. Priority Date: 06/16/2006
• Status: Active Grant

• Current Assignee: Articulated Technologies, LLC
• Original Assignee: Articulated Technologies, LLC
• Inventors: Daniels, John J.
• Granted Patent: US 7,858,994 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: G09G 2300/0452 Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: G09G 3/3406 Control of illumination source illumination devices structurally associated with liquid crystal cells G02F1/1336
• CPC Class Codes: G09G 3/3413 Details of control of colour illumination sources
• CPC Class Codes: G09G 3/3426 the different display panel areas being distributed in two dimensions, e.g. matrix
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 31/022466 made of transparent conductive layers, e.g. TCO, ITO layers
• CPC Class Codes: H01L 31/1884 Manufacture of transparent electrodes, e.g. TCO, ITO

Abstract

An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the bottom electrically conductive surface. An electrical insulator separates the bottom electrically conductive surface from the top electrically conductive surface. At least one bare die electronic element is provided having a top conductive side and a bottom conductive side. Each bare die electronic element is disposed so that the top conductive side is in electrical communication with the top electrically conductive surface and so that the bottom conductive side is in electrical communication with the bottom electrically conductive surface.

Claims

1. ) A light emitting device, comprising:

a first bottom substrate having an electrically conductive surface;

a second bottom substrate having an electrically conductive surface;

a first bare die light emitting diode device having a top p junction conductor and a bottom n junction conductor, the bottom n junction conductor in electrical communication with the electrically conductive surface of the first bottom conductor;

a second bare die light emitting diode device having a top n junction conductor and a bottom p junction conductor, the bottom p junction conductor in electrical communication with the electrically conductive surface of the second bottom conductor; and

a top substrate having a conductive surface, said conductive surface in electrical communication with both the top p junction conductor of the first bare die light emitting diode device and the top n junction conductor of the second bare die light emitting diode device, the electrically conductive surface of the top substrate being effective for putting the first bare die light emitting diode device and the second bare die light emitting diode device into a series electrical connection.

2. ) A light emitting device according to claim 1;

wherein the electrically conductive surface of at least the first bottom substrate, the second bottom substrate and the top substrate has a predetermined resistance value effective to create a ballast resistor in series with the first bare die light emitting diode device and the second bare die light emitting diode device.

3. ) A light emitting device according to claim 1;

further comprising a third bare die light emitting diode device having a top p junction conductor and a bottom n junction conductor, the bottom n junction conductor in electrical communication with the electrically conductive surface of the second bottom conductor;

at least one subsequent bottom substrate having subsequent electrically conductive surface;

subsequent bare die light emitting diodes in electrical communication with the subsequent electrically conductive surface; and

at least one subsequent top substrate having a subsequent top conductive surface in electrical communication with the third bare die light emitting diode and the subsequent bare die light emitting diodes so that the subsequent bare die light emitting diodes are connected in series; and

additional subsequent series connection substrates as needed having a subsequent series connecting conductive surface in electrical communication with remaining subsequent bare die light emitting diode devices so that the subsequent bare die light emitting diodes on the at least one subsequent substrates are connected in series.

4. ) A light emitting device according to claim 1;

further comprising opposite polarity bare die light emitting diode devices electrically connected in respective opposite polarity to and along with the first bare die light emitting diode device and the second bare die light emitting diode device to form a light emitting device that emits light when driven with an AC voltage.

5. ) A light emitting device according to claim 1, further comprising;

an adhesive adhering the top substrate to the first bottom substrate and to the second bottom substrate and encapsulating the first bare die light emitting diode device and the second bare die light emitting diode device, the adhesive adhering the first bare die light emitting diode device to the first bottom substrate and to the top substrate while maintaining the electrical communication between the top p junction conductor of the first bare die light emitting diode device to the conductive surface of the first bottom substrate and maintaining the electrical communication between the bottom n junction conductor of the first bare die light emitting diode device to the conductive surface of the top substrate, the adhesive adhering the second bare die light emitting diode device to the second bottom substrate and to the top substrate while maintaining the electrical communication between the bottom p junction conductor of the second bare die light emitting diode device to the conductive surface of the second bottom substrate and maintaining the electrical communication between the top n junction conductor of the second bare die light emitting diode device to the conductive surface of the top substrate.

6. ) A light emitting device according to claim 5;

wherein the adhesive comprises at least one of a thermally active adhesive, a catalyst active adhesive, a solvent evaporation active adhesive and a radiation active adhesive.

7. ) A light emitting device according to claim 5;

wherein the first and the second bare die light emitting diode devices are embedded in the adhesive with respective top conductive side and the bottom conductive side left at least partially uncovered by the adhesive so that the adhesive binds the first bottom substrate and the second bottom substrate to the top substrate with the first and the second bare die light emitting diode devices in electrical communication with the respective conductive surfaces.

8. ) A bare die semiconductor circuit, comprising:

a first substrate having an electrically conductive surface;

a second substrate having an electrically conductive surface;

a first bare die semiconductor circuit element having a first conductor and a second conductor, the second conductor of the first bare die semiconductor circuit element in electrical communication with the electrically conductive surface of the first substrate;

a second bare die semiconductor circuit element having a first conductor and a second conductor, the second conductor of the second bare die semiconductor circuit element in electrical communication with the electrically conductive surface of the second substrate; and

a series connecting substrate having a conductive surface, said conductive surface of the series connecting substrate in electrical communication with both the first conductor of the first bare die semiconductor circuit element and the first conductor of the second bare die semiconductor circuit element, the electrically conductive surface of the series connecting substrate being effective for putting the first bare die semiconductor circuit element and the second bare die semiconductor circuit element into a series electrical connection.

9. ) A bare die semiconductor circuit according to claim 8;

wherein the electrically conductive surface of at least the first substrate, the second substrate and the series connecting substrate has a predetermined resistance value effective to create a ballast resistor in series with the first bare die semiconductor circuit element and the second bare semiconductor circuit element.

10. ) A bare die semiconductor circuit according to claim 8;

further comprising at least one subsequent bottom substrate having subsequent electrically conductive surface;

subsequent bare die semiconductor circuit elements in electrical communication with said subsequent electrically conductive surface; and

at least one subsequent top substrate having a subsequent top conductive surface in electrical communication with the subsequent bare die semiconductor circuit elements so that the subsequent bare die semiconductor circuit elements are connected in series with the first bare die semiconductor circuit element and the second bare die semiconductor circuit element.

11. ) A bare die semiconductor circuit according to claim 8;

further comprising opposite polarity bare die semiconductor circuit elements electrically connected in respective opposite polarity to and along with the first bare die semiconductor circuit element and the second bare die semiconductor circuit element to form an electronic circuit that conducts in both polarity directions.

12. ) A bare die semiconductor circuit according to claim 8, further comprising;

an adhesive adhering the series connecting substrate to the first substrate and to the second substrate, the adhesive adhering the first bare die semiconductor circuit element to the first substrate and to the series connecting substrate while maintaining the electrical communication between the second conductor of the first bare die semiconductor circuit element to the conductive surface of the first substrate and maintaining the electrical communication between the first conductor of the first bare die semiconductor circuit element to the conductive surface of the series connecting substrate, the adhesive adhering the second bare die semiconductor circuit element to the second substrate and to the series connecting substrate while maintaining the electrical communication between the second conductor of the second bare die semiconductor circuit element to the conductive surface of the second substrate and maintaining the electrical communication between the first conductor of the second bare die semiconductor circuit element to the conductive surface of the series connecting substrate.

13. ) A light emitting device according to claim 12;

wherein the adhesive comprises at least one of a thermally active adhesive, a catalyst active adhesive, a solvent evaporation active adhesive and a radiation active adhesive.

14. ) A light emitting device according to claim 12;

wherein the first and the second bare die semiconductor circuit elements are at least partially embedded in the adhesive with a respective top conductive side and bottom conductive side left at least partially uncovered by the adhesive so that the adhesive binds the first substrate and the second substrate to the series connecting substrate with the first and the second bare die semiconductor circuit elements in electrical communication with the respective conductive surfaces.

15. ) A solid state light emitting device having series connected bare die light emitting diode devices for forming a higher voltage light emitting device, comprising:

a first substrate having an electrically conductive surface;

a second substrate having an electrically conductive surface;

a first bare die light emitting diode device having a first junction of a first polarity and a second junction of a second polarity, the second junction of the first bare die light emitting diode device in electrical communication with the electrically conductive surface of the first substrate;

a second bare die light emitting diode device having a first junction of the second polarity and a second junction of the first polarity, the second junction of the second bare die light emitting diode device in electrical communication with the electrically conductive surface of the second substrate; and

a series connecting substrate having a conductive surface, said conductive surface of the series connecting substrate in electrical communication with both the first junction of the first bare die light emitting diode device and the first junction of the second bare die light emitting diode device, the electrically conductive surface of the series connecting substrate being effective for putting the first bare die light emitting diode device and the second bare die light emitting diode device into a series electrical connection.

16. ) A solid state light emitting device according to claim 15;

wherein the electrically conductive surface of at least the first substrate, the second substrate and the series connecting substrate has a predetermined resistance value effective to create a ballast resistor in series with the first bare die semiconductor circuit element and the second bare semiconductor circuit element.

17. ) A bare die semiconductor circuit according to claim 15;

further comprising a third bare die light emitting diode having a first junction of a first polarity and a second junction of a second polarity, the second junction of the third bare die light emitting diode device in electrical communication with the electrically conductive surface of the second substrate;

at least one subsequent substrate having subsequent electrically conductive surface;

subsequent bare die light emitting diode devices in electrical communication with said subsequent electrically conductive surface;

a first subsequent series connecting substrate having a subsequent series connecting conductive surface in electrical communication with the third bare die light emitting diode and the subsequent bare die light emitting diode devices so that the subsequent bare die light emitting diode devices are connected in series with the first bare die light emitting diode device and the second bare die light emitting diode device; and

additional subsequent series connection substrates as needed having a subsequent series connecting conductive surface in electrical communication with remaining subsequent bare die light emitting diode devices so that the subsequent bare die light emitting diodes on the at least one subsequent substrates are connected in series.

18. ) A solid state light emitting device according to claim 15;

further comprising opposite polarity bare die light emitting diode devices electrically connected in respective opposite polarity to and along with the first bare die light emitting diode device and the second bare die light emitting diode device to form an electronic circuit that conducts in both polarity directions.

19. ) A solid state light emitting device according to claim 15, further comprising;

an adhesive at least partially encapsulating the first bare die light emitting diode device and the second bare die light emitting diode device, the adhesive adhering the first bare die light emitting diode device to the first substrate and to the series connecting substrate while maintaining the electrical communication between the first junction of the first bare die light emitting diode device to the conductive surface of the first substrate and maintaining the electrical communication between the second junction of the first bare die light emitting diode device to the conductive surface of the series connecting substrate, the adhesive adhering the second bare die light emitting diode device to the second substrate and to the series connecting substrate while maintaining the electrical communication between the first junction of the second bare die light emitting diode device to the conductive surface of the second substrate and maintaining the electrical communication between the second junction of the second bare die light emitting diode device to the conductive surface of the series connecting substrate.

20. ) A solid state light emitting device according to claim 19;

wherein the adhesive comprises at least one of a thermally active adhesive, a catalyst active adhesive, a solvent evaporation active adhesive and a radiation active adhesive.