BONDED CHIP ASSEMBLY WITH A MICRO-MOVER FOR MICROELECTROMECHANICAL SYSTEMS
First Claim
Patent Images
1. A system for positioning a movable plate within a sealed environment, the system comprising:
- a movable plate arranged in a plane;
a stationary portion arranged in the plane;
a suspension connected between the movable plate and the stationary portion;
a first cap fixedly connected with the stationary portion so that a cavity is disposed between the first cap and the movable plate;
a current path fixedly connected with the movable plate and disposed at least partially within the cavity;
a second cap fixedly connected with the stationary portion so that the movable plate is disposed between the first cap and the second cap;
a magnetic field device including;
a first plate,a magnet associated with the first plate, anda second plate;
wherein the first plate and the magnet are connected with the first cap so that the first cap is disposed between the magnet and the movable plate;
wherein the second plate is connected with the second cap so that the second cap is disposed between the second plate and the movable plate;
wherein the second plate, the first plate and the magnet are generally aligned so that a magnetic flux generated by the magnet is substantially contained between the first plate and the second plate; and
wherein the movable plate can be moved within the plane relative to the stationary portion when a current is applied to the current path.
1 Assignment
0 Petitions
Accused Products
Abstract
An embodiment of a micro-mover in accordance with the present invention can include a movable plate hermetically sealed between a top cap wafer and a bottom cap wafer. A magnet disposed on one or both of the cap wafers. The movable plate can include current paths disposed within a magnetic field generated by the magnet, and coaxially with a surface of the movable plate. When current is applied to the current paths, the movable plate is urged some distance within a gap between the movable plate and a stationary portion disposed co-planar with the movable plate.
-
Citations
23 Claims
-
1. A system for positioning a movable plate within a sealed environment, the system comprising:
-
a movable plate arranged in a plane; a stationary portion arranged in the plane; a suspension connected between the movable plate and the stationary portion; a first cap fixedly connected with the stationary portion so that a cavity is disposed between the first cap and the movable plate; a current path fixedly connected with the movable plate and disposed at least partially within the cavity; a second cap fixedly connected with the stationary portion so that the movable plate is disposed between the first cap and the second cap; a magnetic field device including; a first plate, a magnet associated with the first plate, and a second plate; wherein the first plate and the magnet are connected with the first cap so that the first cap is disposed between the magnet and the movable plate; wherein the second plate is connected with the second cap so that the second cap is disposed between the second plate and the movable plate; wherein the second plate, the first plate and the magnet are generally aligned so that a magnetic flux generated by the magnet is substantially contained between the first plate and the second plate; and wherein the movable plate can be moved within the plane relative to the stationary portion when a current is applied to the current path. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 17, 19)
-
-
13. A system for selectively positioning a movable plate, the system comprising:
-
a movable plate arranged in a plane; a stationary portion arranged in the plane such that the movable plate is nested within the stationary portion, the stationary portion; a suspension connected between the movable plate and the stationary portion; a cap fixedly connected with the stationary portion; a current path fixedly connected with the movable plate and disposed at least partially within the cavity; a magnetic field device associated with the current path; an x capacitive sensor including a first x electrode disposed on the movable plate and a second x electrode disposed on the cap and aligned with the first x electrode; and a y capacitive sensor including a first y electrode disposed on the movable plate and a second y electrode disposed on the cap and aligned with the first y electrode; wherein the movable plate can be moved within the plane relative to the stationary portion when a current is applied to the current path; and wherein the x capacitive sensor and the y capacitive sensor are used to determine displacement of the movable plate relative to the cap. - View Dependent Claims (14, 15, 16, 18)
-
-
20. A method of reducing mass of a movable plate having current paths for positioning a media device, the method comprising:
-
depositing metal on a surface of the movable plate to form current paths over a first portion of the surface; and etching a second portion of the surface of the movable plate, so that the first portion disposed beneath the current paths has a thickness with a desired bending characteristic and the second portion has a thickness smaller than the first portion.
-
-
21. A method of minimizing a mass of a movable plate having current paths for positioning a media device, the method comprising:
-
using the movable plate formed of silicon; forming a layer of thermal oxide on a surface of the movable plate; depositing a metal layer on the thermal oxide; etching the metal layer such that a current path is formed; and etching the thermal oxide such that a bending characteristic of the thermal oxide resists a bending characteristic of the current path. - View Dependent Claims (22, 23)
-
Specification