Method for producing a lens mold

• US 20070290383A1
• Filed: 08/20/2007
• Published: 12/20/2007
• Est. Priority Date: 08/04/2000
• Status: Abandoned Application

• Current Assignee: Georg Bogner, Gunter Waitl, Patrick Kromotis, Werner Marchl, Werner Spath, Wolfgang Gramann
• Original Assignee: Georg Bogner, Gunter Waitl, Patrick Kromotis, Werner Marchl, Werner Spath, Wolfgang Gramann
• Inventors: Bogner, Georg, Marchl, Werner, Waitl, Gunter, Spath, Werner, Kromotis, Patrick, Gramann, Wolfgang
• Application Number:
  US11/894,569
• Publication Number:
  US 20070290383A1
• Time in Patent Office: Days
• US Class Current: 264/2.5
• CPC Class Codes: B29D 11/00278 Lenticular sheets B29D11/00269 takes precedence
• CPC Class Codes: B29D 11/00365 Production of microlenses lenticular sheets B29D11/00278
• CPC Class Codes: F21V 5/04 of lens shape
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 3/0031 Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
• CPC Class Codes: G02B 3/0056 arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses G02B3/0043 takes precedence; miniaturised objectives for electronic devices employing wafer level optics G02B13/0085
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

A method for producing a lens mold suitable for manufacturing a field of micro-lenses is disclosed. The method includes the step of molding the lens mold from a sheaf of closely-packed balls held by a hexagonal mounting.

Claims

1. A method for producing a lens mold suitable for manufacturing a field of micro-lenses, comprising the step of molding the lens mold from a sheaf of closely-packed balls held by a hexagonal mounting.

2. The method of claim 1, wherein the lens mold is cast from silicone.

3. The method of claim 1, wherein the mounting is surrounded by a silicone frame comprising an opening, said opening being aligned with the mounting.

4. The method of claim 3, wherein the silicone frame is produced by filling silicone into the interior defined by a holder frame mounted on a first mold plate and surrounding an arbor of the first mold plate.

5. The method of claim 1, wherein the balls have a radius that is essentially equivalent to the radius of the micro-lenses to be produced.