Lithography Processes Using Phase Change Compositions

• US 20070290387A1
• Filed: 09/23/2005
• Published: 12/20/2007
• Est. Priority Date: 10/08/2004
• Status: Active Grant

• Current Assignee: Dow Corning Corporation (Dow, Inc.)
• Original Assignee: Dow Corning Corporation (Dow, Inc.)
• Inventors: Chen, Wei, Sudbury-Holtschlag, Joan, Petroff, Lenin, Harkness, Brian
• Granted Patent: US 8,147,742 B2
• Time in Patent Office: Days
• US Class Current: 264/39
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: G03F 7/0002 Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Abstract

A lithography method includes the steps of: A) filling a mold having a patterned surface with a phase change composition at a temperature above the phase change temperature of the phase change composition; B) hardening the phase change composition to form a patterned feature; C) separating the mold and the patterned feature; optionally D) etching the patterned feature; optionally E) cleaning the mold; and optionally F) repeating steps A) to D) reusing the mold. The PCC may include an organofunctional silicone wax.

Claims

1. A method comprising:

A) filling a mold having a patterned surface with a phase change composition at a temperature above the phase change temperature of the phase change composition;

B) hardening the phase change composition to form a patterned feature;

C) separating the mold and the patterned feature;

optionally D) etching the patterned feature;

optionally E) cleaning the mold; and

optionally F) repeating steps A) to E) reusing the mold.

2. The method of claim 1, where the phase change composition comprises a silicone matrix.

3. The method of claim 1, where the phase change composition comprises an organofunctional silicone wax.

4. The method of claim 1, where the phase change composition comprises an uncrosslinked organofunctional silicone wax.

5. The method of claim 4, where the uncrosslinked organofunctional silicone wax comprises a wax selected from:

(R³₂SiO)_m(R³R¹SiO)_n, R²R³₂SiO(R³R⁴SiO)_x(R³₂SiO)_y(R³R¹SiO)_zSiR³₂R², or a combination thereof, where each R¹ is independently an organic waxy group, each R² is a substituted or unsubstituted monovalent hydrocarbon group having at least 1 carbon atom, each R³ is independently a substituted or unsubstituted monovalent hydrocarbon group of 1 to 10 carbon atoms, each R⁴ is independently R³ or a polyoxyalkylene group, m has a value greater than or equal to 0, n has a value greater than or equal to 1, m+n has a value ranging from 1 to 8, x has a value ranging from 0 to 600, y has a value ranging from 0 to 200, and z has a value ranging from 1 to 200.

6. The method of claim 1, where the phase change composition comprises a crosslinked organofunctional silicone wax.

7. The method of claim 6, where the crosslinked organofunctional silicone wax has unit formula:

8. The method of claim 1, where the PCC comprises an organic wax.

9. The method of claim 1, where the PCC comprises a combination of an organic wax and an organofunctional silicone wax.

10. The method of any one of the preceding claims, further comprising:

I) casting a curable silicone composition against a master,

II) curing the curable silicone composition to form the mold, and

III) removing the mold from the master before step A).

11. The method of any one of the preceding claims, where the method is used in a lithography technique selected from the group consisting of:

imprint molding, step and flash imprint molding, solvent assisted micromolding, microtransfer molding, and micromolding in capillaries.

12. A patterned feature prepared by the method of any one of the preceding claims.