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Sawing tile corners on probe card substrates

  • US 20070290705A1
  • Filed: 06/16/2006
  • Published: 12/20/2007
  • Est. Priority Date: 06/16/2006
  • Status: Active Grant
First Claim
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1. A probe card assembly for testing semiconductor devices comprising a composite substrate formed from individual substrates, wherein at least a portion of the individual substrates have at least one corner removed.

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