MICRO POWER CONVERTER AND METHOD OF MANUFACTURING SAME
First Claim
Patent Images
1. A micro power converter comprising:
- a coil substrate including a coil and external electrodes, a power supply IC chip bonded on a front surface side of the coil substrate, and a resin covering the front surface side of the coil substrate and a front surface side of the power supply IC chip;
wherein the coil substrate has a magnetic insulator substrate, coil conductors formed in inner regions on front and back surfaces of the magnetic insulator substrate, and the external electrodes formed in peripheral regions on the front and back surfaces of the magnetic insulator substrate;
wherein the coil conductors formed in the inner regions on the front and back surfaces of the magnetic insulator substrate are connected by first connection conductors to form the coil and the external electrodes formed on the front and back surfaces of the magnetic insulator substrate are connected by second connection conductors; and
wherein the second connection conductors are surrounded by the magnetic insulator substrate in the front surface side of the magnetic insulator substrate and a side face of the second connection conductor is exposed to an atmosphere in the back surface side of the magnetic insulator substrate.
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Abstract
A micro power converter is provided in which magnetic flux passing a route outside of external electrodes and second connection conductors is decreased to reduce noises, and at the same time, adhesiveness of molding resin is preserved to provide excellent humidity resistance.
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Citations
6 Claims
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1. A micro power converter comprising:
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a coil substrate including a coil and external electrodes, a power supply IC chip bonded on a front surface side of the coil substrate, and a resin covering the front surface side of the coil substrate and a front surface side of the power supply IC chip;
wherein the coil substrate has a magnetic insulator substrate, coil conductors formed in inner regions on front and back surfaces of the magnetic insulator substrate, and the external electrodes formed in peripheral regions on the front and back surfaces of the magnetic insulator substrate;
wherein the coil conductors formed in the inner regions on the front and back surfaces of the magnetic insulator substrate are connected by first connection conductors to form the coil and the external electrodes formed on the front and back surfaces of the magnetic insulator substrate are connected by second connection conductors; and
wherein the second connection conductors are surrounded by the magnetic insulator substrate in the front surface side of the magnetic insulator substrate and a side face of the second connection conductor is exposed to an atmosphere in the back surface side of the magnetic insulator substrate. - View Dependent Claims (2, 3, 4)
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5. A method of manufacturing a micro power converter that includes a magnetic insulator substrate, a power supply IC chip bonded on a front surface side of the magnetic insulator substrate, and a resin covering the front surface side of the magnetic insulator substrate and a front surface side of the power supply IC chip, the method comprising:
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(i) (a) forming a plurality of first holes from a front surface side towards an interior of the magnetic insulator substrate, and (b) forming plural pairs of second holes surrounding the first holes and in either side of a straight line that becomes a scribe line, the pair of second holes consisting of two second holes disposed at line symmetric positions with respect to the straight line;
(ii) (a) forming third holes each connecting to each of the first holes from a back surface side of the magnetic insulator substrate at positions projecting the first holes towards interior of the magnetic insulator substrate, and (b) forming fourth holes with a oblong shape each connecting to each of the pairs of the second holes at a place including the positions projecting the pair of the second holes surrounding the third holes from the back surface side towards interior of the magnetic insulator substrate;
(iii) (a) forming coil conductors on front and back surfaces of the magnetic insulator substrate connecting different first holes and different second holes, (b) the forming first connection conductors on side walls of the first holes and third holes connecting the coil conductors formed on the front and back surfaces, (c) forming plural pairs of front side external electrodes on the front surface side of the magnetic insulator substrate, each pair disposed at a place including the second holes, surrounded by the magnetic insulator substrate, off the scribe line and along the scribe line, and positioned in line symmetric with respect to the scribe line, (d) forming back side external electrodes on the back surface side of the magnetic insulator substrate at places including at least a part of the positions projecting the pairs of second holes, and (e) forming second connection conductors on side walls of the second holes and the fourth holes, each second connection conductor connecting the front side external conductor and the back side external conductor;
(iv) connecting the power supply IC chip to the front surface side of the magnetic insulator substrate;
(v) covering the front surface side of the magnetic insulator substrate and front surface side of the power supply IC chip with the resin; and
(vi) cutting the magnetic insulator substrate and the resin along the scribe line positioned between two external electrodes composing a pair on the front side of magnetic insulator substrate. - View Dependent Claims (6)
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Specification