PROCESS FOR OPTICALLY TRANSPARENT VIA FILLING

• US 20070291496A1
• Filed: 05/01/2007
• Published: 12/20/2007
• Est. Priority Date: 06/02/2006
• Status: Active Grant

• Current Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Original Assignee: Electro Scientific Industries Incorporated (MKS Instruments Incorporated)
• Inventors: Howerton, Jeffrey, Nashner, Michael S.
• Granted Patent: US 8,394,301 B2
• Time in Patent Office: Days
• US Class Current: 362/375
• CPC Class Codes: B29D 11/00663 Production of light guides

Abstract

A method of forming a filled via with an optically transmissive material and a resulting product. The method comprises drilling a via in a panel and filling the via with an optically transmissive material. The method can also be used to create a light transmissive section of a housing. A light source directed to one side of the via is seen through the optically transmissive material so as to be visible to a viewer viewing a surface at the second side of the via.

Claims

1. A method of forming a filled via with an optically transmissive material comprising:

drilling a via in a panel; and

filling the via with an optically transmissive material.

2. The method as in claim 1 wherein the optically transmissive material is curable and the method further comprises:

curing the optically transmissive material after filling the via.

3. The method as in claim 1 wherein the via is conically shaped.

4. The method as in claim 2 wherein the via includes a first end having a first diameter between 60 to 200 micrometers and a second end having a second diameter between 10 to 50 micrometers.

5. The method as in claim 1 wherein the via is drilled by a laser.

6. The method as in claim 5, further comprising:

cleaning the via using at least one of a CO2 snow jet, ultrasonic cleaning and high-pressure air.

7. The method as in claim 4 wherein the material is cured with a UV light.

8. A housing having a light transmissive panel formed using the method of claim 4.

10. The housing as in claim 8 wherein a light source is positioned on one side of the via.

11. The housing as in claim 10 wherein the optically transmissive polymer is an UV curable acrylate polymer.

9. A housing having a light transmissive panel wherein the light transmissive panel comprises:

an optically transmissive polymer captured by at least one via in the panel.

12. The housing as in claim 9 wherein the via includes a first diameter between 60 and 200 micrometers and a second diameter between 10 and 50 micrometers and the light source is positioned adjacent the first diameter.

13. A housing having a light transmissive section wherein the light transmissive section is formed by a method comprising:

drilling a via in the light transmissive section;

filling the via with a curable polymer; and

curing the polymer.

14. The housing as in claim 13 wherein the method further comprises:

cleaning the via before filling the via.

15. The housing as in claim 13 wherein the via is drilled using a laser.

16. The housing as in claim 13 wherein excess polymer is removed before curing the polymer.

17. The housing as in claim 14 wherein the polymer is cured with an ultraviolet light.