PROCESS FOR OPTICALLY TRANSPARENT VIA FILLING
First Claim
Patent Images
1. A method of forming a filled via with an optically transmissive material comprising:
- drilling a via in a panel; and
filling the via with an optically transmissive material.
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Abstract
A method of forming a filled via with an optically transmissive material and a resulting product. The method comprises drilling a via in a panel and filling the via with an optically transmissive material. The method can also be used to create a light transmissive section of a housing. A light source directed to one side of the via is seen through the optically transmissive material so as to be visible to a viewer viewing a surface at the second side of the via.
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Citations
17 Claims
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1. A method of forming a filled via with an optically transmissive material comprising:
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drilling a via in a panel; and filling the via with an optically transmissive material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 10, 11)
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9. A housing having a light transmissive panel wherein the light transmissive panel comprises:
an optically transmissive polymer captured by at least one via in the panel. - View Dependent Claims (12)
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13. A housing having a light transmissive section wherein the light transmissive section is formed by a method comprising:
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drilling a via in the light transmissive section; filling the via with a curable polymer; and curing the polymer. - View Dependent Claims (14, 15, 16, 17)
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Specification