Solder composition

• US 20070292708A1
• Filed: 05/21/2007
• Published: 12/20/2007
• Est. Priority Date: 08/12/2005
• Status: Abandoned Application

• Current Assignee: Antaya Technologies Corporation (Aptiv PLC)
• Original Assignee: Antaya Technologies Corporation (Aptiv PLC)
• Inventors: Pereira, John
• Application Number:
  US11/805,250
• Publication Number:
  US 20070292708A1
• Time in Patent Office: Days
• US Class Current: 428/594
• CPC Class Codes: B23K 1/0008 specially adapted for particular articles or work
• CPC Class Codes: B23K 20/10 making use of vibrations, e.g. ultrasonic welding
• CPC Class Codes: B23K 2101/38 Conductors
• CPC Class Codes: B23K 35/262 Sn as the principal constituent
• CPC Class Codes: C03C 17/36 at least one coating being a metal
• CPC Class Codes: C03C 17/3673 specially adapted for use in heating devices for rear window of vehicles
• CPC Class Codes: C03C 27/046 of metals, metal oxides or metal salts only
• CPC Class Codes: Y10T 428/12347 Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]

Abstract

A solder composition having a mixture of elements including tin, indium, silver, and bismuth, and can include about 30% to 85% tin and about 15% to 65% indium.

Claims

1. A method of soldering comprising:

soldering an electrical connector to a surface on a plastic component with a layer of a non lead solder composition comprising tin, indium and silver, and including about 30% to 85% tin and about 13% to 65% indium, a melting temperature below about 400°

F., and a solidus temperature below about 330°

F.

2. The method of claim 1 further comprising providing the layer of the solder composition with a thickness between about 0.004 to 0.006 inches thick.

3. The method of claim 2 further comprising forming the layer of solder on the electrical connector prior to soldering.

4. The method of claim 1 further comprising providing the solder composition with about 1% to 10% silver and about 0.25% to 0.75% copper.

5. The method of claim 4 further comprising providing the solder composition with about 0.25% to 6% bismuth.

6. The method of claim 1 further comprising providing the solder composition with about 78% to 85% tin, about 13% to 16% indium, about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.

7. The method of claim 1 further comprising providing the solder composition with the melting temperature below about 390°

F. and the solidus temperature below about 310°

F.

8. The method of claim 7 further comprising providing the solder composition with about 73% to 78% tin, about 17% to 22% indium, about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.

9. The method of claim 1 further comprising providing the solder composition with the melting temperature below about 380°

F. and the solidus temperature below about 280°

F.

10. The method of claim 9 further comprising providing the solder composition with about 70% to 74% tin, about 18% to 26% indium, about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.

11. The method of claim 1 further comprising providing the solder composition with the melting temperature below about 370°

F. and the solidus temperature below about 250°

F.

12. The method of claim 11 further comprising providing the solder composition with about 66% to 69% tin, about 22% to 26% indium, about 1% to 7% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.

13. The method of claim 1 further comprising providing the solder composition with the melting temperature below about 350°

F. and the solidus temperature below about 240°

F.

14. The method of claim 13 further comprising providing the solder composition with about 60% to 63% tin, about 28% to 33% indium, about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.

15. The method of claim 1 further comprising providing the solder composition with the melting temperature below about 310°

F. and the solidus temperature below about 250°

F.

16. The method of claim 15 further comprising providing the solder composition with about 59% to 61% tin, about 34% to 36% indium, about 4% to 5% silver, and about 0.4% to 0.6% copper.

17. The method of claim 1 further comprising providing the solder composition with the melting temperature and the solidus temperature below about 260°

F.

18. The method of claim 17 further comprising providing the solder composition with about 49% to 52% tin, about 40% to 44% indium, about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.

19. The method of claim 17 further comprising providing the solder composition with about 49% to 52% tin, about 45% to 47% indium, about 3% to 4% silver, and about 0.4% to 0.6% copper.

20. The method of claim 17 further comprising the solder composition with about 65% indium, about 30% tin, about 4.5% silver, and about 0.5% copper.

21. An electrical connection comprising:

an electrical connector soldered to a surface on a plastic component with a layer of a non lead solder composition comprising tin, indium and silver, and including about 30% to 85% tin and about 13% to 65% indium, a melting temperature below about 400°

F., and a solidus temperature below about 330°

F.

22. The electrical connection of claim 21 in which the layer of the solder composition has a thickness of about 0.004 inches thick.

23. The electrical connection of claim 21 in which the solder composition has about 1% to 10% silver and about 0.25% to 0.75% copper.

24. The electrical connection of claim 23 in which the solder composition has about 0.25% to 6% bismuth.

25. The electrical connection of claim 21 in which the solder composition comprises about 78% to 85% tin, about 13% to 16% indium, about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.

26. The electrical connection of claim 21 in which the melting temperature of the solder composition is below about 390°

F. and the solidus temperature is below about 310°

F.

27. The electrical connection of claim 26 in which the solder composition comprises about 73% to 78% tin, about 17% to 22% indium, about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.

28. The electrical connection of claim 21 in which the melting temperature of the solder composition is below about 380°

F. and the solidus temperature is below about 280°

F.

29. The electrical connection of claim 28 in which the solder composition comprises about 70% to 74% tin, about 18% to 26% indium, about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.

30. The electrical connection of claim 21 in which the melting temperature of the solder composition is below about 370°

F. and the solidus temperature is below about 250°

F.

31. The electrical connection of claim 30 in which the solder composition comprises about 66% to 69% tin, about 22% to 26% indium, about 1% to 7% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.

32. The electrical connection of claim 21 in which the melting temperature of the solder composition is below about 350°

F. and the solidus temperature is below about 240°

F.

33. The electrical connection of claim 32 in which the solder composition comprises about 60% to 63% tin, about 28% to 33% indium, about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.

34. The electrical connection of claim 21 in which the melting temperature of the solder composition is below about 310°

F. and the solidus temperature is below about 250°

F.

35. The electrical connection of claim 34 in which the solder composition comprises about 59% to 61% tin, about 34% to 36% indium, about 4% to 5% silver, and about 0.4% to 0.6% copper.

36. The electrical connection of claim 21 in which the melting temperature and the solidus temperature of the solder composition are below about 260°

F.

37. The electrical connection of claim 36 in which the solder composition comprises about 49% to 52% tin, about 40% to 44% indium, about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.

38. The electrical connection of claim 36 in which the solder composition comprises about 49% to 52% tin, about 45% to 47% indium, about 3% to 4% silver, and about 0.4% to 0.6% copper.

39. The electrical connection of claim 36 in which the solder composition comprises about 65% indium, about 30% tin, about 4.5% silver, and about 0.5% copper.