Method For Making A Radio Frequency Coupling Structure

• US 20070294879A1
• Filed: 08/31/2005
• Published: 12/27/2007
• Est. Priority Date: 09/02/2004
• Status: Active Grant

• Current Assignee: Dupont Polymers Inc. (DuPont de Nemours, Inc.)
• Original Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Inventors: Mehdizadeh, Mehrdad
• Granted Patent: US 7,530,166 B2
• Time in Patent Office: Days
• US Class Current: 29/600
• CPC Class Codes: H01P 11/003 Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 with selective destruction of conductive paths

Abstract

Method for making a coupling structure (10) comprises the steps of forming a body (12B) of a polymeric material loaded with a conductive filler, providing a coupling area (12C) of a predetermined shape on a portion of the surface of the body (12S), and attaching a conductive pad (IOP) having a shape corresponding to the shape of the coupling area (12C) in non-penetrating contact with the body (12B).

Claims

1. A method for making a coupling structure comprising the steps of:

a) forming a body of a polymeric material loaded with a conductive filler, the body having a surface;

b) providing a coupling area of a predetermined shape on a portion of the surface; and

c) attaching a conductive pad having a shape corresponding to the shape of the coupling area in non-penetrating contact with the body.

2. The method of claim 1 wherein the attaching step c) comprises the step of:

adhering the conductive pad to the coupling area.

3. The method of claim 2 wherein the adhering step is performed using an adhesive.

4. The method of claim 3 wherein the adhesive is a dielectric material.

5. The method of claim 3 wherein the adhesive includes a conductive material.

6. The method of claim 1 wherein the attaching step c) comprises the step of:

forming a metallization layer over the coupling a rea.

7. The method of claim 1 wherein the attaching step c) comprises the step of:

using a biasing member to urge the conductive pad against the coupling area.

8. The method of claim 1 wherein the step b) of forming the body of a polymeric material produces a region having a lower concentration of conductive filler material than the concentration in the remainder of the body, and wherein the step c) of providing a coupling area comprises the step of:

removing the surface region with a lower concentration of conductive filler material.

9. The method of claim 8 wherein the removing step is preformed by grinding.

10. The method of claim 8 wherein the removing step is preformed by machining.

11. The method of claim 8 wherein the removing step is preformed by etching.

12. The method of claim 8 wherein the removing step is preformed by laser ablating.