SYSTEM FOR FORMING LEAF LAMINATES
First Claim
Patent Images
1. A method of forming a laminate including a leaf characterized by a pattern on a substrate, comprising the steps of:
- a) printing an image corresponding to said pattern on said substrate using an ink having adhesive properties;
b) covering said substrate including said image with a thin frangible leaf;
c) laminating said leaf onto said image by applying pressure to said leaf, image and substrate; and
d) mechanically agitating said leaf in order to remove excess leaf outside the boundaries of the image by flaking the excess leaf off the substrate.
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Abstract
A method of forming a laminate including a very thin leaf layer. In a first step an image corresponding to a desired pattern is printed in a conventional manner on said substrate using an ink having adhesive properties. The substrate and image are then covered with a very thin, frangible leaf material such a very thin metal foil. The leaf material is then laminated onto said image by applying pressure to said leaf, image and substrate. Mechanical agitation is then used to remove excess leaf outside the boundaries of the image by flaking off the excess leaf from the substrate.
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Citations
25 Claims
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1. A method of forming a laminate including a leaf characterized by a pattern on a substrate, comprising the steps of:
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a) printing an image corresponding to said pattern on said substrate using an ink having adhesive properties; b) covering said substrate including said image with a thin frangible leaf; c) laminating said leaf onto said image by applying pressure to said leaf, image and substrate; and d) mechanically agitating said leaf in order to remove excess leaf outside the boundaries of the image by flaking the excess leaf off the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of forming a laminate having a thin metal leaf layer in order to fabricate an electrical circuit or decorative element on the surface of the laminate, comprising the steps of:
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a) printing a pattern for said circuit on a planar substrate using an ink having adhesive properties; b) covering said substrate including said pattern with a thin frangible metal leaf; c) laminating said metal leaf onto said pattern by applying pressure to said leaf, pattern and substrate; and d) flaking the metal leaf off of said substrate outside of the boundaries of said pattern. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification