Tempering Methods and Tempering Device for the Thermal Treatment of Small Amounts of Liquid

• US 20070295705A1
• Filed: 05/24/2005
• Published: 12/27/2007
• Est. Priority Date: 05/25/2004
• Status: Abandoned Application

• Current Assignee: Beckman Coulter Incorporated (Danaher Corporation)
• Original Assignee: Beckman Coulter Incorporated (Danaher Corporation)
• Inventors: Geisbauer, Andreas
• Application Number:
  US11/597,399
• Publication Number:
  US 20070295705A1
• Time in Patent Office: Days
• US Class Current: 219/162
• CPC Class Codes: B01L 2300/1805 Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
• CPC Class Codes: B01L 2300/1816 using induction heating
• CPC Class Codes: B01L 2300/1827 using resistive heater
• CPC Class Codes: B01L 3/5088 confining liquids at a location by surface tension, e.g. virtual wells on plates, wires B01L3/50857 takes precedence
• CPC Class Codes: B01L 7/5255 by moving sample containers

Abstract

Tempering methods are provided for performing a defined, particularly cyclical thermal treatment of small amounts of liquid on substrates. One or several amounts of liquid are applied to a substrate. The substrate is brought in thermal contact with heating apparatus that is started during heating phases of the thermal treatment. A thermally conductive element having thermal capacity greater than or equal to the sum of thermal capacities of the amounts of liquid, substrate and at least part of the heating apparatus in thermal contact with the substrate, is brought in thermal contact with the substrate or the heating apparatus during cooling phases of the thermal treatment. Thermal contact between the thermally conductive element and substrate is interrupted and the heating apparatus started during heating phases of the thermal treatment. A tempering method in which substrates having integrated heating are used as well a tempering device suitable for carrying out these methods, are also provided.

Claims

1. A temperature control process for performing a defined, in particular cyclical, thermal treatment of small amounts of liquid, in which

one or several amounts of liquid are applied onto a substrate (1),

the substrate (1) is brought into thermal contact with a heating device (7) which is started up during the heating phases of the thermal treatment,

a thermally conductive element (9) is brought into thermal contact with the substrate or the heating device (7) during the cooling phases of the thermal treatment, the thermal capacity of the heating device being greater than or equal to the sum of the thermal capacities of the amounts of liquid (3), the substrate (1) and at least that part of the heating device (7) which is in thermal contact with the substrate, and

the thermal contact between the thermally conductive element (9) and the substrate (1) is interrupted during the heating phases of the thermal treatment and the heating device (7) is started up.

2. The temperature control process according to claim 1 in which the substrate is placed onto the heating device (7) and the thermally conductive element (9) is brought into thermal contact with the heating device (7) during the cooling phases.

7. The temperature control process according to claim 1, in which an essentially planar substrate (1) is used.

8. The temperature control process according to claim 1, in which one or several amount(s) of liquid are applied onto the substrate (1) in the form of droplets (3).

9. The temperature control process according to claim 8 in which the droplets (3) have dimensions such and the wetting properties of the surface of the substrate (1) are selected such that the droplets (3) are held together on the surface of the substrate (1) by their surface tension.

10. The temperature control process according to claim 8 in which the one or several amounts of liquid which have been applied in the form of droplets (3) onto the substrate (1) are coated with an oil film (5) in order to prevent the evaporation of the one or several amounts of liquid (3).

11. The temperature control process according to claim 1 to 10, in which the one or several quantities of liquid (3) are applied on the substrate (1) onto anchoring points which, in comparison with their surroundings, exhibit surface characteristics on the substrate (1) which lead to preferred wetting by the one or several amounts of liquid (3).

12. The temperature control process according to claim 1 in which the heat absorbed by the thermally conductive element (9) during a cooling phase is given off to a cooling body (11, 17) when the thermally conductive element (9) is not in thermal contact with the substrate (1).

32. A use of a temperature control process according to claim 1 for PCR (polymerase chain reaction) applications.

3. A temperature control process for performing a defined, in particular cyclical, thermal treatment of small amounts of liquid in which

one or several amounts of liquid are applied onto a substrate, the substrate being equipped with a heating device,

a thermally conductive element is brought into thermal contact with the substrate during the cooling phases of the thermal treatment, the thermal capacity of the element being greater than or equal to the sum of the thermal capacities of the amounts of liquid and the substrate, and

the thermal contact between the thermally conductive element and the substrate is interrupted during the heating phases of the thermal treatment and the heating device is started up.

4. The temperature control process according to claim 3 in which a substrate is used which has, via an integrated resistance heating device, a preferably vapour deposited resistance heating device at its disposal.

5. The temperature control process according to claim 4 in which the substrate is brought into contact with contact devices by means of which a current can be passed through the resistance heating device.

6. The temperature control process according to claim 3 in which a substrate is used which is equipped with an inductive heating device.

13. A temperature control device for performing a defined, in particular cyclical, thermal treatment of small amounts of liquid on substrates, which device is equipped with the following:

a heating device (7),

a retaining device for a substrate (1) which allows the substrate (1) to be placed into thermal contact with the heating device (7),

a thermally conductive element (9) which can be brought into thermal contact with a substrate (1) held by the retaining device or with the heating device (7) and whose thermal capacity is greater than the sum of the thermal capacities of the substrate (1) and the heating device (7) and

a movement device (13, 15) which is designed in such a way that it is capable of bringing the thermally conductive element (9) into thermal contact with the substrate (1) or the heating device (7).

14. The temperature control device according to claim 13 in which the retaining device is formed by the heating device (7).

15. The temperature control device according to claim 13 in which the heating device comprises a heating plate (7).

16. The temperature control device according to claim 15 in which the heating device comprises a silicon heating plate (7).

20. The temperature control device according to claim 13 in which the retaining device is designed for retaining an essentially planar substrate (1).

21. The temperature control device according to claim 13 in which the movement device comprises an electric magnet (13).

22. The temperature control device according to claim 13 in which the thermally conductive element comprises a block (9) of thermally conductive material, in particular of aluminium or copper.

23. The temperature control device according to claim 13 with at least one cooling body (11, 17), the movement device (13, 15) being designed in such a way that it is capable of bringing the thermally conductive element (9) into thermal contact with the cooling body (11, 17).

24. The temperature control device according to claim 23 in which the cooling body comprises a block (11) of thermally conductive material, in particular of aluminium or copper with a thermal capacity greater than that of the thermally conductive element (9).

25. The temperature control device according to claim 23 in which the cooling body comprises cooling fins (17).

26. The temperature control device according to claim 13 with a Peltier cooling element, a liquid cooling or an air current cooling.

27. The temperature control device according to claim 13 with a temperature measuring device.

28. The temperature control device according to claim 13 with a control, preferably a microprocessor control for the automated control of the heating device (7) and the movement device (13, 15).

29. The temperature control device according to claim 28 with a temperature measuring device, in which the control is designed in such a way that it uses the signal from the temperature measuring device as a control variable for controlling the heating device (7) and the movement device (13, 15) for creating a desired temperature development.

17. A temperature control device for performing a defined, in particular cyclical, thermal treatment of small amounts of liquid on substrates, which device exhibits the following:

a retaining device for a substrate which is equipped with an integrated heating device,

an energy supply device by means of which energy can be introduced into the heating device of the substrate in order to heat it,

a thermally conductive element which can be brought into thermal contact with a substrate held by the retaining device and whose thermal capacity is greater than the thermal capacity of the substrate and

a movement device which is designed in such a way that it is capable of bringing the thermally conductive element into thermal contact with the substrate.

18. The temperature control device according to claim 17 in which the retaining device is designed such that it is capable of positioning a substrate with a preferably vapour deposited electrical resistance heating and the energy supply device comprises a source of current and contacts connected therewith which, on placing of the substrate into the retaining device, are in contact with the resistance heating.

19. The temperature control device according to claim 17 in which a substrate with an induction heating can be used and the energy supply device comprises a device for introducing energy into the induction heating.

30. A Substrate with a preferably vapour deposited resistance heating device for use in a temperature control device according to claim 18.

31. A substrate with a preferably vapour deposited induction heating for use in a temperature control device according to claim 19.