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Semiconductor device structure for reducing mismatch effects

  • US 20070296013A1
  • Filed: 06/26/2006
  • Published: 12/27/2007
  • Est. Priority Date: 06/26/2006
  • Status: Active Grant
First Claim
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1. An integrated circuit chip comprising:

  • a first electronic device comprising a first feature, the first electronic device having a first footprint area in a given layer;

    a second electronic device comprising a second feature, the second electronic device having a second footprint area in the given layer, and the first and second electronic devices being electrically matched; and

    a common electrode feature that is common to the first and second electronic devices, the common electrode feature being at least partially located in the given layer,wherein more than a majority of the first footprint area overlaps with the second footprint area,wherein a first spacing between the first feature and the common electrode feature is about the same as a second spacing between the second feature and the common electrode feature, andwherein the first spacing is less than about three times a width of the common electrode feature.

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