PROBE HAVING A FRAME TO ALIGN SPRING PINS PERPENDICULARLY TO A PRINTED CIRCUIT BOARD, AND METHOD OF MAKING SAME

• US 20070296425A1
• Filed: 06/07/2006
• Published: 12/27/2007
• Est. Priority Date: 06/07/2006
• Status: Active Grant

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Holcombe, Brent, LaMeres, Brock J.
• Granted Patent: US 7,323,892 B1
• Time in Patent Office: Days
• US Class Current: 324/750.25
• CPC Class Codes: G01R 1/07328 for testing printed circuit boards
• CPC Class Codes: G01R 31/2808 Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards probe, multiprobe, probe manipulator or probe fixture G01R1/067

Abstract

In one embodiment, a probe for probing test points on a target board includes a printed circuit board, a frame, and a plurality of spring pins. The printed circuit board (PCB) has a first side with a plurality of solder pads thereon, and a plurality of signal routes that are electrically coupled to the solder pads for routing signals to a test instrument. The frame is mechanically coupled to the PCB and has a main body portion with a plurality of holes therein. The holes in the frame are aligned with the plurality of solder pads on the first side of the PCB. The plurality of spring pins are provided for probing the test points on the target board, with each spring pin being i) disposed in one of the holes in the frame, perpendicularly abutting the first side of the PCB, and ii) electrically coupled to one of the solder pads. Other embodiments, including a method of making a probe, are also disclosed.

Claims

1. A probe for probing test points on a target board, comprising:

a printed circuit board (PCB) having i) a first side with a plurality of solder pads thereon, ii) a second side, opposite the first side, iii) a plurality of signal routes that are electrically coupled to the solder pads for routing signals to a test instrument, and iv) a plurality of holes therein;

a frame, mechanically coupled to the PCB, having i) a main body portion with a plurality of holes therein, the holes in the frame being aligned with the plurality of solder pads on the first side of the PCB, and ii) a plurality of posts that extend from the main body portion of the frame into the plurality of holes in the PCB;

a plurality of spring pins for probing the test points on the target board, each spring pin of which is i) disposed in one of the holes in the frame, perpendicularly abutting the first side of the PCB, and ii) electrically coupled to one of the solder pads; and

a plate adjacent the second side of the PCB, the plate having a plurality of holes therein to receive the plurality of posts extending from the main body portion of the frame, and the plate being mechanically coupled to the frame via the plurality of posts.

5. The probe of claim 1, wherein

the probe further comprises an adhesive, in contact with the posts and the plate, to mechanically couple the frame to the plate, and thus to the PCB.

6. The probe of claim 5, further comprising a plurality of fasteners that extend through the plate toward the second side of the PCB;

the fasteners being configured and positioned to mate with a retention device on the target board.

7. The probe of claim 1, wherein the frame further comprises a plurality of feet, extending perpendicularly from the main body portion of the frame and abutting the first side of the PCB, to provide a predetermined spacing between the main body portion of the frame and the first side of the PCB.

8. The probe of claim 1, wherein the signal routes comprise tip-network components positioned adjacent the spring pins.

9. The probe of claim 8, wherein the tip-network components comprise isolation resistors.

10. The probe of claim 1, wherein the frame further comprises a relief pattern corresponding to a retention device on the target board, for mechanically coupling the frame to the retention device.

11. The probe of claim 1, wherein the frame is formed from a rigid, non-conductive plastic.

18. The probe of claim 1, wherein the probe further comprises a snap-type mechanism that mechanically couples the frame to the plate.

20. The probe of claim 1, wherein the posts comprise enlarged and slightly deformable ends that mechanically couple the frame to the plate.

2-4. -4. (canceled)

12-17. -17. (canceled)

19. The probe of claim I, wherein the probe further comprises a compression mechanism that mechanically couples the frame to the plate.