MEMS DEVICE HAVING A RECESSED CAVITY AND METHODS THEREFOR
First Claim
1. A microelectromechanical systems based device, comprising:
- a transparent substrate having a microelectromechanical systems device formed thereon;
a substantially planar backplate upon which a material is applied to form a raised perimeter structure; and
a seal joining the raised perimeter structure of the backplate to the transparent substrate.
3 Assignments
0 Petitions
Accused Products
Abstract
A microelectromechanical systems device having a transparent substrate joined to a planar backplate with a raised perimeter structure forming a recessed cavity or cell. The raised perimeter structure is formed by applying a first layer around the peripheral area of the backplate to form a recessed cell. A second layer is applied over the first layer. The first layer is thicker than the second layer. The thicker layer comprises a viscous material. A second layer is a thinner adhesive layer, and is applied over the thicker layer to join the backplate to the transparent substrate to encapsulate the microelectromechanical systems device formed on the transparent substrate.
108 Citations
45 Claims
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1. A microelectromechanical systems based device, comprising:
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a transparent substrate having a microelectromechanical systems device formed thereon; a substantially planar backplate upon which a material is applied to form a raised perimeter structure; and a seal joining the raised perimeter structure of the backplate to the transparent substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A method of manufacturing a display device, comprising:
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providing a transparent substrate having a microelectromechanical systems device formed thereon; providing a substantially planar backplate with a first layer comprising a material applied around an outer peripheral area of the backplate; applying an adhesive second layer over the first layer; and joining the backplate to the transparent substrate by contacting the second layer to the transparent substrate to form a package after applying the adhesive second layer, wherein the microelectromechanical systems device is encapsulated by the package. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37)
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38. A microelectromechanical systems based device, comprising:
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a transmitting means for transmitting light therethrough, the transmitting means having a modulating means formed thereon; a substantially planar backplate having a raised perimeter structure joined to the transparent substrate, the raised perimeter structure comprising a material applied to the backplate; and a sealing means for sealing the modulating means within a package between the transmitting means and the backplate. - View Dependent Claims (39, 40, 41, 42, 43, 44, 45)
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Specification