Use Of A Titanium-Copper-Nickel-Based Alloy

• US 20070297933A1
• Filed: 10/21/2005
• Published: 12/27/2007
• Est. Priority Date: 11/05/2004
• Status: Active Grant

• Current Assignee: HEF USA
• Original Assignee: HEF USA
• Inventors: Martin, Michel, Faverjon, Frederic
• Granted Patent: US 7,883,744 B2
• Time in Patent Office: Days
• US Class Current: 420/417
• CPC Class Codes: C22C 14/00 Alloys based on titanium
• CPC Class Codes: C23C 14/205 by cathodic sputtering
• CPC Class Codes: Y10T 428/14 Layer or component removable to expose adhesive
• CPC Class Codes: Y10T 428/149 Sectional layer removable

Abstract

A titanium-copper-nickel based alloy is used for the formation of at least one resistive thin film on a polymer substrate. The alloy comprises 50 to 80% by weight of titanium, 10 to 25% by weight of copper and 10 to 25% by weight of nickel. The thin film has a thickness between about 100 and 160 nanometres.

Claims

1. Use of a titanium-copper-nickel based alloy for formation of at least one resistive thin film on a polymer substrate, the alloy comprising 50 to 80% by weight of titanium, 10 to 25% by weight of copper and 10 mto 25% by weight of nickel, thickness of the thin film being between about 100 and 160 nanometres.

2. Use according to claim 1, wherein the alloy is applied to the substrate by vapour deposition.

3. Use according to claim 1, wherein the alloy comprises 69% by weight of titanium, 15.5% by weight of copper and 15.5% by weight of nickel.

4. Use according to claim 1, wherein the substrate constitutes a surface whereof a side opposite to a side coated with the resistive film containing the titanium-copper-nickel alloy, is coated with a reflecting film, the resistive film is subjected to a power source to subject the resistive film to a voltage of about 12V.