INCREASED TOOL UTILIZATION/REDUCTION IN MWBC FOR UV CURING CHAMBER

• US 20070298362A1
• Filed: 11/21/2006
• Published: 12/27/2007
• Est. Priority Date: 06/26/2006
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Baluja, Sanjeev, Nowak, Thomas, Rocha-Alvarez, Juan Carlos, Kaszuba, Andrzej, Mukuti, Ndanka O.
• Granted Patent: US 7,554,103 B2
• Time in Patent Office: Days
• US Class Current: 432/9
• CPC Class Codes: F27B 17/0025 Especially adapted for treating semiconductor wafers
• CPC Class Codes: H01L 21/67115 mainly by radiation

Abstract

A pump liner is used to direct a laminar flow of purge gas across a workpiece to remove contaminants or species outgassed or otherwise produced by the workpiece during processing. The pump liner can take the form of a ring having a plurality of injection ports, such as slits of a variety of shapes and/or sizes, opposite a plurality of receiving ports in order to provide the laminar flow. The flow of purge gas is sufficient to carry a contaminant or outgassed species from the processing chamber in order to prevent the collection of the contaminants on components of the chamber. The pump liner can be heated, via conduction and irradiation from a radiation source, for example, in order to prevent the condensation of species on the liner. The pump liner also can be anodized or otherwise processed in order to increase the emissivity of the liner.

Claims

1. A system for curing a workpiece, comprising:

a chamber housing;

a substrate support in the chamber housing for supporting a workpiece;

a radiation source operable to direct radiation onto a workpiece supported on the substrate support in order to cure the workpiece; and

a pump liner having a gas inlet plenum and a gas outlet plenum for receiving and exhausting a flow of purge gas, the pump liner having a plurality of injection slits operable to direct a substantially laminar flow of purge gas across a surface of the workpiece being cured by the radiation, the pump liner further having a plurality of receiving slits opposite the plurality of injection slits operable to receive the flow of gas directed across the wafer, the receiving slits being further operable to receive any species outgassed from the workpiece during the curing process.

2. A system according to claim 1, further comprising:

a source of purge gas operable to direct the flow of purge gas to the pump liner.

3. A system according to claim 1, wherein:

the flow of purge gas has a mass and momentum sufficient to carry away a species outgassed from the workpiece during curing.

4. A system according to claim 1, wherein:

the pump liner has a plurality of contact members for contacting the chamber housing, the contact members minimizing a contact area between the pump liner and the chamber housing in order to reduce the ability for heat flow from the pump liner to the chamber housing.

5. A system according to claim 1, wherein the pump liner is an aluminum pump liner.

6. A system according to claim 1, wherein at least a portion of an exposed surface of the pump liner is anodized.

7. A system according to claim 1, wherein:

the radiation source is further operable to direct radiation to at least a portion of the pump liner, whereby a temperature of the pump liner is increased.

8. A system according to claim 1, further comprising:

a window positioned between the radiation source and the workpiece support, the window having a diameter sufficient such that the radiation source can direct radiation to an entire workpiece surface to be cured and at least a portion of the pump liner,

wherein the flow of purge gas substantially minimizes the collection of outgassed species on the window.

9. A system according to claim 1, further comprising:

a heating element in thermal contact with the pump liner, the heating element operable to bring the pump liner to a pre-determined temperature before the flow of purge gas is directed across the surface of the workpiece.

10. A system according to claim 1, further comprising:

the radiation source includes at least one ultraviolet (UV) lamp.

11. A pump liner fur directing a flow of purge gas across a workpiece in a processing chamber, comprising:

a ring-shaped element having a central opening adapted to fit around a periphery of a workpiece, the ring-shaped element having an inlet plenum operable to receive a flow of purge gas into a first channel in the ring-shaped element and an exhaust plenum operable to direct the flow of purge gas out of a second channel in the ring-shaped element;

a plurality of injection ports positioned near the central opening of the ring-shaped element and operable to direct the flow of purge gas, received by the inlet plenum, from the first channel and across a surface of the workpiece, the injection ports operable to direct a substantially laminar flow of the purge gas across the surface; and

a plurality of receiving ports positioned near the central opening of the ring-shaped element, the receiving ports being substantially opposite the plurality of injection ports, and operable to receive the flow of purge gas directed across the surface of the workpiece, as well as any species outgassed by the workpiece carried by the flow, and direct the flow and outgassed species through the second channel and out of the ring-shaped element through the exhaust plenum.

12. A pump liner according to claim 11, wherein:

the pump liner is formed of aluminum.

13. A pump liner according to claim 11, wherein:

at least a portion of an exposed surface of the pump liner is anodized.

14. A pump liner according to claim 11, wherein:

each of the plurality of injection ports and plurality of receiving ports includes a plurality of slits in the ring-shaped element.

15. A pump liner according to claim 11, wherein:

the ring-shaped element further has a plurality of contact members for contacting a chamber housing, the contact members minimizing a contact area between the ring-shaped element and the chamber housing in order to reduce the ability for heat flow from the ring-shaped element to the chamber housing.

16. A pump liner according to claim 11, wherein:

the ring-shaped element includes first and second mating portions.

17. A pump liner according to claim 11, wherein:

each of the plurality of injection ports and plurality of receiving ports is at least one of shaped, sized, and positioned to provide for the substantially laminar flow.

18. A pump liner according to claim 11, wherein:

the plurality of injection ports includes a plurality of injection ports of at least one of different shapes and different sizes.

19. A method for curing a workpiece, comprising:

positioning a workpiece to be cured on a workpiece support in a processing chamber;

directing radiation toward a surface of the workpiece on the workpiece support, the radiation selected to cure at least a layer of material on the surface;

providing a flow of purge gas across the irradiated surface of the workpiece, the flow of purge gas emanating from a pump liner having a plurality of injection slits and a plurality of receiving slits for directing a substantially laminar flow of purge gas across the irradiated surface of the workpiece, the flow of purge gas sufficient to transport any species outgassed from the irradiated surface of the workpiece; and

exhausting the flow of purge gas and the outgassed species after the flow passes across the irradiated surface and is received by the receiving slits of the pump liner.

20. A method according to claim 19, further comprising:

selecting at least one of a shape, size, position, and number of at least one of the plurality of injection slits and a plurality of receiving slits in order to provide for the substantially laminar flow.

21. A method according to claim 19, further comprising:

directing a portion of the radiation toward a portion of the pump liner in order to increase an operating temperature of the pump liner.

22. A method according to claim 19, further comprising:

minimizing a contact area between the pump liner and a body of the processing chamber in order to minimize an amount of heat flow from the pump liner to the body.

23. A method according to claim 19, further comprising:

anodizing the pump liner in order to increase an emissivity of the pump liner.

24. A method according to claim 19, wherein:

providing a flow of purge gas includes providing a flow of argon gas.

25. A method according to claim 19, wherein:

providing a flow of purge gas includes providing a flow of purge gas at a distance of less than 0.150″

above the irradiated surface.