METHOD FOR FORMING NANOSTRUCTURE HAVING HIGH ASPECT RATIO AND METHOD FOR FORMING NANOPATTERN USING THE SAME

• US 20080000871A1
• Filed: 11/07/2005
• Published: 01/03/2008
• Est. Priority Date: 08/29/2005
• Status: Active Grant

• Current Assignee: Seoul National University Industry Foundation (Seoul National University)
• Original Assignee: Seoul National University Industry Foundation (Seoul National University)
• Inventors: Suh, Kahp-Yang, Jeong, Hoon-Eui
• Granted Patent: US 7,632,417 B2
• Time in Patent Office: Days
• US Class Current: 216/2
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: C03C 17/3405 with at least two coatings of organic materials C03C17/36, C03C17/42 take precedence
• CPC Class Codes: G03F 7/0002 Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
• CPC Class Codes: H01L 21/0337 characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment

Abstract

Provided is a method of forming a nanostructure having a nano-sized diameter and a high aspect ratio through a simple and economical process. To form the nanostructure, a polymer thin film is formed on a substrate and a mold is brought to contact the polymer thin film. Then, a polymer patterning is formed to contact the background surface of an engraved part of the mold, and then the polymer pattern is extended out by removing the mold out of the polymer thin film. The nanostructure forming method of the present research can reproduce diverse cilia optimized in the natural world. Also, it can be used to develop new materials with an ultra-hydrophobic property or a high adhesiveness. Further, it can be applied to a nanopattern forming process for miniaturizing electronic devices and to various ultra-precise industrial technologies together with carbon nanotube, which stands in the highlight recently.

Claims

1. A method of forming a nanostructure having a high aspect ratio, comprising:

forming a polymer thin film on a substrate;

contacting a mold with the polymer thin film;

forming a polymer pattern contacting a background surface of an engraved part of the mold by making the polymer thin film flow; and

forming a nanostructure with the polymer pattern extended out by removing the mold out of the polymer thin film with the polymer pattern formed thereon.

2. The method of claim 1, wherein the polymer thin film comprises thermoplastic resin.

3. The method of claim 1, wherein the mold comprises one selected from the group consisting of polyurethane, poly-dimethylsiloxane (PDMS), and silicon dioxide (SiO₂).

4. The method of claim 1, wherein the making the polymer thin film flow is performed by heating up the polymer thin film.

5. The method of claim 1, wherein the polymer pattern contacting the background surface of the engraved part is formed in an extrusion molding method by applying pressure of 0.1 to 10 atmospheric pressure to the mold.

6. The method of claim 1, wherein the polymer pattern contacting the background surface of the engraved part is formed by positioning the substrate with the polymer thin film in the upper part and the mold in the lower part and promoting formation of the polymer pattern contacting the background surface of the engraved part based on gravity.

7. The method of claim 1, wherein a surface energy difference between the substrate and the polymer thin film is less than a surface energy difference between the polymer thin film and the mold.

8. The method of claim 1, wherein an extent of the extension of the polymer pattern is controlled by adjusting the surface energy difference between the polymer thin film and the mold.

9. The method of claim 1, further comprising controlling a surface energy of the substrate by performing a surface treatment on the substrate before the forming of the polymer thin film.

10. The method of claim 1, further comprising controlling a surface energy of the mold by performing a surface treatment on the mold before the contacting a mold with the polymer thin film.

11. The method of claim 1, further comprising improving contact evenness between the polymer thin film and the mold by applying pressure to the mold after the contacting of the mold.

12. A method of forming a nanopattern, comprising:

forming a polymer thin film on a substrate;

contacting a pattern of a mold with the polymer thin film;

forming a polymer pattern contacting a background surface of an engraved part of the mold by making the polymer thin film flow;

forming a nanostructure with the polymer pattern extended out by removing the mold out of the polymer thin film with the polymer pattern formed thereon;

forming a nanopattern on the substrate by using the extended nanostructure as a mask and etching the substrate; and

removing the nanostructure out of the substrate with the nanopattern formed thereon.