Non-volatile memory device and method of manufacturing the non-volatile memory device
First Claim
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1. A non-volatile memory device, comprising:
- a substrate having a field region and an active region including a rounded upper edge portion and a flat upper central portion;
an effective tunnel oxide layer on the flat upper central portion of the active region;
a split floating gate electrode on the effective tunnel oxide layer, the floating gate electrode having a width greater than a width of the effective tunnel oxide layer;
a dielectric layer pattern on the floating gate electrode, the dielectric layer pattern including metal oxide; and
a control gate electrode on the dielectric layer pattern.
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Abstract
A non-volatile memory device may include a substrate having a field region and an active region including a rounded upper edge portion and a flat upper central portion, an effective tunnel oxide layer on the flat upper central portion of the active region, a split floating gate electrode on the effective tunnel oxide layer, the floating gate electrode having a width greater than a width of the effective tunnel oxide layer, a dielectric layer pattern on the floating gate electrode, the dielectric layer pattern including metal oxide, and a control gate electrode on the dielectric layer pattern.
43 Citations
20 Claims
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1. A non-volatile memory device, comprising:
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a substrate having a field region and an active region including a rounded upper edge portion and a flat upper central portion; an effective tunnel oxide layer on the flat upper central portion of the active region; a split floating gate electrode on the effective tunnel oxide layer, the floating gate electrode having a width greater than a width of the effective tunnel oxide layer; a dielectric layer pattern on the floating gate electrode, the dielectric layer pattern including metal oxide; and a control gate electrode on the dielectric layer pattern. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of manufacturing a non-volatile memory device, comprising:
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forming a preliminary gate structure on a substrate, the preliminary gate structure including a preliminary tunnel oxide layer, a preliminary floating gate electrode and a preliminary dielectric layer pattern including metal oxide, which are sequentially stacked; selectively oxidizing surfaces of the substrate at sides of the preliminary gate structure to form an effective tunnel oxide layer including the preliminary tunnel oxide layer; forming trench isolation layers in the substrate at the sides of the preliminary gate structure to define a field region and an active region of the substrate; forming a conductive layer on the preliminary gate structure; and patterning the preliminary floating gate electrode, the preliminary dielectric layer pattern and the conductive layer to form a floating gate electrode, a dielectric layer pattern and a control gate electrode. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of manufacturing a non-volatile memory device, comprising:
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forming a preliminary gate structure on a substrate, the preliminary gate structure including a preliminary tunnel oxide layer and a preliminary floating gate electrode sequentially stacked; selectively oxidizing surfaces of the substrate at both sides of the preliminary gate structure to form an effective tunnel oxide layer including the preliminary tunnel oxide layer; forming trench isolation layers in the substrate at the both sides of the preliminary gate structure to define a field region and an active region of the substrate, the active region having a flat upper central portion on which the effective tunnel oxide layer is positioned; sequentially forming a dielectric layer including metal oxide and a control gate layer on the preliminary gate structure; and patterning the preliminary floating gate electrode, the dielectric layer and the control gate layer to form a split floating gate electrode, a dielectric layer pattern and a control gate electrode. - View Dependent Claims (19, 20)
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Specification