Light emitting diode

• US 20080001523A1
• Filed: 02/16/2007
• Published: 01/03/2008
• Est. Priority Date: 06/29/2006
• Status: Abandoned Application

• Current Assignee: Steve Hwang
• Original Assignee: Steve Hwang
• Inventors: Hwang, Steve
• Application Number:
  US11/707,240
• Publication Number:
  US 20080001523A1
• Time in Patent Office: Days
• US Class Current: 313/498
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 21/35 with direct electrical contact between the supporting element and electric conductors running along the guiding element
• CPC Class Codes: F21V 23/002 Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308

Abstract

A light emitting diode comprising a plurality of light emitting semiconductor dice; a conductive plate including a positive electrode plate, a negative electrode plate, and a carrier plate. A receiving space is formed between the positive electrode plate, the negative electrode plate and the carrier plate and an upper plate serves for carrying a plurality of light emitting semiconductor dice. The electrodes of the light emitting semiconductor die are at two opposite sides, which includes a positive electrode sheet and a negative electrode sheet. The positive electrode sheet serves for electrically contacting the adjacent positive electrode plate and the negative electrode sheet serves for electrically contacting the adjacent negative electrode sheet. After electric conduction, a light mask serves to package the light emitting semiconductor die.

Claims

1. A light emitting diode, comprising:

a plurality of light emitting semiconductor dice (2, 3);

a conductive plate including a positive electrode plate (41), a negative electrode plate (42), and a carrier plate (43);

the carrier plate (43) being an insulated plate and clamped between the positive electrode plate (41) and negative electrode plate (42) with a thickness smaller than that of the positive electrode plate (41) and the negative electrode plate (42) so that a receiving space (44) is formed between the positive electrode plate (41), the negative electrode plate (42) and the carrier plate (43) and an upper plate (432) serving for carrying a plurality of light emitting semiconductor dice (2, 3);

wherein the electrodes of the light emitting semiconductor die (2) are at two opposite sides, which includes a positive electrode sheet (21) and a negative electrode sheet (22) the positive electrode sheet (21) serves for electrically contacting the adjacent positive electrode plate (41) and the negative electrode sheet (22) serves for electrically contacting the adjacent negative electrode sheet (22); and

after electric conduction, a light mask (5) serves to package the light emitting semiconductor die (2).

2. The light emitting diode as claimed in claim 1, wherein a bottom surface (431) of the carrier plate (43) is coplanar with one side of the positive electrode plate (41) and one side of the negative electrode plate (42).

3. The light emitting diode as claimed in claim 1, wherein the positive electrode plate (41), the negative electrode plate (42), and a carrier plate (43) are formed integrally.