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Overlay measuring method and related semiconductor fabrication equipment management system

  • US 20080002875A1
  • Filed: 01/23/2007
  • Published: 01/03/2008
  • Est. Priority Date: 06/30/2006
  • Status: Active Grant
First Claim
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1. An overlay measuring method comprising:

  • setting a map corresponding to a wafer using a measuring apparatus computer and a reference recipe output from a host computer;

    inputting setup data comprising a setup position and an allowable range corresponding to the setup position to the measuring apparatus computer, wherein the setup position is obtained from reticle information;

    recognizing and measuring a position of a center of the wafer using an optical unit connected to the measuring apparatus computer;

    recognizing and measuring a position of a wafer alignment mark using the optical unit, wherein the wafer alignment mark is formed on a boundary of a plurality of chips formed on the wafer and the position of the center of the wafer and the position of the wafer alignment mark are defined relative to the map;

    inputting measurement data comprising a measured position of a wafer overlay mark to the measuring apparatus computer, wherein the wafer overlay mark is separated from the wafer alignment mark;

    comparing the measurement data with the setup data; and

    ,outputting an interlock control signal from the measuring apparatus computer if the measured position of the wafer overlay mark is outside of the allowable range.

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