Overlay measuring method and related semiconductor fabrication equipment management system
First Claim
1. An overlay measuring method comprising:
- setting a map corresponding to a wafer using a measuring apparatus computer and a reference recipe output from a host computer;
inputting setup data comprising a setup position and an allowable range corresponding to the setup position to the measuring apparatus computer, wherein the setup position is obtained from reticle information;
recognizing and measuring a position of a center of the wafer using an optical unit connected to the measuring apparatus computer;
recognizing and measuring a position of a wafer alignment mark using the optical unit, wherein the wafer alignment mark is formed on a boundary of a plurality of chips formed on the wafer and the position of the center of the wafer and the position of the wafer alignment mark are defined relative to the map;
inputting measurement data comprising a measured position of a wafer overlay mark to the measuring apparatus computer, wherein the wafer overlay mark is separated from the wafer alignment mark;
comparing the measurement data with the setup data; and
,outputting an interlock control signal from the measuring apparatus computer if the measured position of the wafer overlay mark is outside of the allowable range.
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Abstract
Embodiments of the invention provide an overlay measuring method and a semiconductor fabrication equipment management system adapted to perform the method. In one embodiment, the method comprises setting a map corresponding to a wafer using a measuring apparatus computer and a reference recipe output from a host computer, inputting setup data comprising a setup position and an allowable range corresponding to the setup position to the measuring apparatus computer, recognizing and measuring a position of a center of the wafer, and recognizing and measuring a position of a wafer alignment mark. The method further comprises inputting measurement data comprising a measured position of a wafer overlay mark to the measuring apparatus computer, comparing the measurement data with the setup data, and outputting an interlock control signal from the measuring apparatus computer if the measured position of the wafer overlay mark is outside of the allowable range.
15 Citations
18 Claims
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1. An overlay measuring method comprising:
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setting a map corresponding to a wafer using a measuring apparatus computer and a reference recipe output from a host computer; inputting setup data comprising a setup position and an allowable range corresponding to the setup position to the measuring apparatus computer, wherein the setup position is obtained from reticle information; recognizing and measuring a position of a center of the wafer using an optical unit connected to the measuring apparatus computer; recognizing and measuring a position of a wafer alignment mark using the optical unit, wherein the wafer alignment mark is formed on a boundary of a plurality of chips formed on the wafer and the position of the center of the wafer and the position of the wafer alignment mark are defined relative to the map; inputting measurement data comprising a measured position of a wafer overlay mark to the measuring apparatus computer, wherein the wafer overlay mark is separated from the wafer alignment mark; comparing the measurement data with the setup data; and
,outputting an interlock control signal from the measuring apparatus computer if the measured position of the wafer overlay mark is outside of the allowable range. - View Dependent Claims (2, 3)
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4. An overlay measuring method comprising:
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outputting a reference recipe from a host computer; using a measuring apparatus computer to set a map corresponding to a wafer using the reference recipe received from the host computer; inputting setup data comprising a setup position and an allowable range corresponding to the setup position to the measuring apparatus computer, wherein the setup position is obtained from reticle information; aligning the wafer on a wafer stage of an overlay measuring apparatus comprising an optical unit; recognizing and measuring a position of the center of the wafer defined relative to the map using the optical unit; recognizing and measuring a position of a wafer alignment mark formed on a boundary of a first plurality of chips formed on the wafer and disposed proximate the center of the wafer; inputting measurement data comprising a measured position of a wafer overlay mark to the measuring apparatus computer, wherein the wafer overlay mark is separated from the wafer alignment mark; comparing the measurement data with the setup data; and
,outputting an interlock control signal from the measuring apparatus computer if the measured position of the wafer overlay mark is outside of the allowable range. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A management system for semiconductor fabrication equipment comprising:
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an overlay measuring apparatus adapted to perform an overlay evaluation process to calculate a compensation value for a wafer overlay mark formed on a wafer and adapted to measure a position of the wafer overlay mark; a host computer comprising a database and adapted to output from the database information used in controlling the overlay measuring apparatus; and
,a measuring apparatus computer electrically connected between the host computer and the overlay measuring apparatus and adapted to compare the measured position of the wafer overlay mark with setup data and output an interlock control signal if the measured position of the overlay mark is outside of an allowable range, wherein; the setup data comprises a setup position and the allowable range; the setup position is based on reticle information and is received from the host computer or an operator; and
,the allowable range corresponds to the setup position. - View Dependent Claims (17, 18)
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Specification