PROCESS CONTROL MONITORS FOR INTERFEROMETRIC MODULATORS
First Claim
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1. A method of manufacturing an apparatus comprising a micro-electro-mechanical system (MEMS) and a process control monitor, comprising:
- forming a MEMS structure, wherein forming the MEMS structure includes one or more material deposition and patterning steps; and
forming a process control monitor, wherein forming the process control monitor includes one or more of the material deposition and patterning steps, wherein the process control monitor comprises less than all components present in the MEMS structure.
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Abstract
Process control monitors are disclosed that are produced using at least some of the same process steps used to manufacture a MEMS device. Analysis of the process control monitors can provide information regarding properties of the MEMS device and components or sub-components in the device. This information can be used to identify errors in processing or to optimize the MEMS device. In some embodiments, analysis of the process control monitors may utilize optical measurements.
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Citations
24 Claims
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1. A method of manufacturing an apparatus comprising a micro-electro-mechanical system (MEMS) and a process control monitor, comprising:
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forming a MEMS structure, wherein forming the MEMS structure includes one or more material deposition and patterning steps; and
forming a process control monitor, wherein forming the process control monitor includes one or more of the material deposition and patterning steps, wherein the process control monitor comprises less than all components present in the MEMS structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of manufacturing a combined micro-electro-mechanical system (MEMS) and process control monitor structure, comprising:
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forming at least one MEMS structure on a first side of a substrate through a series of deposition and patterning steps; and
forming at least one process control monitor on the first side of the substrate during formation of the MEMS structure utilizing one or more of the series of deposition and patterning steps, wherein the process control monitor comprises less than all components present in the MEMS structure. - View Dependent Claims (18)
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19. A method of manufacturing a wafer, comprising:
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providing a substantially transparent substrate;
depositing one or more layers on the substrate; and
selectively removing portions of the one or more layers so as to form an interferometric modulator and a process control monitor on the substrate, wherein the process control monitor comprises less than all of the deposited layers. - View Dependent Claims (20, 21, 22, 23, 24)
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Specification