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Wafer-level assembly of heat spreaders for dual IHS packages

  • US 20080003719A1
  • Filed: 06/30/2006
  • Published: 01/03/2008
  • Est. Priority Date: 06/30/2006
  • Status: Active Grant
First Claim
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1. A method comprising:

  • forming a heat spreader (HS) array on a HS support substrate, the HS array having a plurality of heat spreaders;

    forming a diced wafer supported by a wafer support substrate (WSS), the diced wafer having a plurality of thin dice; and

    bonding the thin dice in the diced wafer to the heat spreaders in the HS array to form HS-bonded thin dice between the HS support substrate and the WSS.

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