Method of manufacturing MEMS devices providing air gap control
First Claim
1. A method of making at least two types of microelecromechanical systems (MEMS) devices, the at least two types of MEMS devices having different release states after removal of sacrificial material, the method comprising:
- providing a substrate;
forming a first electrically conductive layer over at least a portion of the substrate;
forming a first sacrificial layer over at least a portion of the first conductive layer;
forming a plurality of electrically conductive moveable elements over the first sacrificial layer; and
forming a plurality of flexure controllers over the substrate configured so as to operably support the electrically conductive moveable elements when the sacrificial layer is removed;
the first sacrificial layer being removable to thereby release the MEMS devices and form cavities having at least two gap sizes between the first electrically conductive layer and the movable elements.
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Accused Products
Abstract
Methods and apparatus are provided for controlling a depth of a cavity between two layers of a light modulating device. A method of making a light modulating device includes providing a substrate, forming a sacrificial layer over at least a portion of the substrate, forming a reflective layer over at least a portion of the sacrificial layer, and forming one or more flexure controllers over the substrate, the flexure controllers configured so as to operably support the reflective layer and to form cavities, upon removal of the sacrificial layer, of a depth measurably different than the thickness of the sacrificial layer, wherein the depth is measured perpendicular to the substrate.
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Citations
43 Claims
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1. A method of making at least two types of microelecromechanical systems (MEMS) devices, the at least two types of MEMS devices having different release states after removal of sacrificial material, the method comprising:
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providing a substrate; forming a first electrically conductive layer over at least a portion of the substrate; forming a first sacrificial layer over at least a portion of the first conductive layer; forming a plurality of electrically conductive moveable elements over the first sacrificial layer; and forming a plurality of flexure controllers over the substrate configured so as to operably support the electrically conductive moveable elements when the sacrificial layer is removed; the first sacrificial layer being removable to thereby release the MEMS devices and form cavities having at least two gap sizes between the first electrically conductive layer and the movable elements. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of making at least two types of interferometric modulators, the at least two types of interferometric modulators having different cavity depths after removal of a sacrificial material, the method comprising
providing a substrate; -
forming an optical stack over at least a portion of the substrate; forming a first sacrificial material over at least a portion of the optical stack, wherein the sacrificial material is removable to thereby form cavities; forming a second electrically conductive layer over portions of the first sacrificial material; and forming at least two types of flexure controllers over the substrate, the flexure controllers configured so as to operably support the second electrically conductive layer, wherein the at least two types of flexure controllers comprise different sized components, the different sized components configured to form cavities of different depths under the portions of the second electrically conductive layer after removal of the first sacrificial layer. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A microelecromechanical system (MEMS) device, comprising:
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a substrate; a plurality of moveable elements over the substrate, each moveable element separated from the substrate by a cavity; and a plurality of flexure controllers over the substrate configured so as to operably support the moveable elements, wherein the plurality of flexure controllers comprise portions of different dimensions to control selected flexures; wherein the selected flexures serve to form the cavities having at least two gap sizes between the substrate and the plurality of movable elements. - View Dependent Claims (24)
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25. A method of controlling a depth of a cavity between two layers of a device comprising one or more film layers, the method comprising:
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providing a substrate; forming a sacrificial layer over at least a portion of the substrate; forming a first layer over at least a portion of the sacrificial layer; and forming one or more flexure controllers over the substrate, the flexure controllers configured so as to operably support the first layer and to form a cavity between the substrate and the first layer, upon removal of the sacrificial layer, of a depth about 30 percent greater or more than the depth of the sacrificial layer, wherein depth is measured perpendicular to the substrate. - View Dependent Claims (26, 27, 28)
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29. An unreleased microelecromechanical system (MEMS) device, comprising:
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a substrate; a sacrificial layer over at least a portion of the substrate; a moveable element over the first sacrificial layer; and one or more flexure controllers over the substrate configured so as to operably support the moveable element and to form a cavity between the substrate and the movable element, upon removal of the sacrificial layer, of a depth about 30 percent greater or more than the depth of the sacrificial layer, wherein depth is measured perpendicular to the substrate; the sacrificial layer being removable by etching. - View Dependent Claims (30, 31)
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32. An unreleased interferometric modulator, comprising:
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first means for reflecting light; second means for reflecting light; first means for supporting the second reflecting means, wherein the first supporting means is removable by etching; and second means for supporting the second reflecting means and for forming a cavity between the first reflecting means and the second reflecting means, upon removal of the first supporting means, of a depth about 30 percent greater or more than the depth of the first supporting means, wherein depth is measured perpendicular to the first reflecting means. - View Dependent Claims (33, 34, 35, 36)
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37. A method of controlling a depth of a cavity between two layers of a device comprising one or more film layers, the method comprising:
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providing a substrate; forming a sacrificial layer over at least a portion of the substrate, the sacrificial layer being removable by etching, forming a first film layer over at least a portion of the sacrificial layer; and forming one or more flexure controllers over the substrate, the flexure controllers configured so as to operably support the first film layer and to displace the first film layer towards the substrate, upon removal of the sacrificial layer.
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38. An unreleased microelecromechanical system (MEMS) device, comprising:
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a substrate; a sacrificial layer over at least a portion of the substrate; a moveable element over the first sacrificial layer; and one or more flexure controllers over the substrate configured so as to operably support the moveable element and to displace the movable element towards the substrate, upon removal of the sacrificial layer; the sacrificial layer being removable by etching.
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39. An unreleased interferometric modulator, comprising:
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first means for reflecting light; second means for reflecting light; first means for supporting the second reflecting means; and second means for supporting the second reflecting means and for effecting a displacement of the second reflecting means towards the first reflecting means upon removal of the first supporting means; wherein the first supporting means is removable by etching. - View Dependent Claims (40, 41, 42, 43)
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Specification