Printed circuit board and method for manufacturing a solderless electrical connection

• US 20080003892A1
• Filed: 06/15/2007
• Published: 01/03/2008
• Est. Priority Date: 06/16/2006
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Fassel, Reinhard, Goettel, Thomas, Hejna, Harald
• Application Number:
  US11/818,639
• Publication Number:
  US 20080003892A1
• Time in Patent Office: Days
• US Class Current: 439/751
• CPC Class Codes: H01R 12/58 terminals for insertion into holes
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2201/10575 Insulating foil under component permanent spacer or stand-off H05K2201/2036
• CPC Class Codes: H05K 2201/1059 Connections made by press-fit insertion
• CPC Class Codes: H05K 3/306 Lead-in-hole components, e.g. affixing or retention before soldering, spacing means H05K3/32 takes precedence

Abstract

A printed circuit board having a plurality of press-fit sockets for accommodating press-fit pins, which are insertable from the direction of a broadside of the printed circuit board with press-fit into through holes of the press-fit sockets. The method includes applying, on a section of the broadside of the printed circuit board, of an insulating protective layer, which has passage holes for the press-fit pins situated above the through holes of the press-fit sockets.

Claims

1. A printed circuit board comprising:

a plurality of press-fit sockets for accommodating press-fit pins, which are insertable from a direction of a broadside of the printed circuit board with press-fit into through holes of the press-fit sockets; and

an insulating protective layer, which is applied onto a section of the broadside of the printed circuit board, and which has passage holes for the press-fit pins situated above the through holes of the press-fit sockets.

2. The printed circuit board of claim 1, wherein the protective layer is made of a pressed-on prepreg film.

3. The printed circuit board of claim 1, wherein the protective layer is made of a laminated-on plastic film.

4. The printed circuit board of claim 1, wherein the protective layer covers annular soldering lands of the press-fit sockets.

5. The printed circuit board of claim 1, wherein the passage holes in the protective layer are aligned with the through holes of the press-fit sockets.

6. The printed circuit board of claim 1, wherein the passage holes in the protective layer have the same or slightly smaller cross-sectional dimensions than the through holes of the press-fit sockets.

7. The printed circuit board of claim 1, wherein the passage holes of the protective layer taper in a direction of the printed circuit board.

8. A method for manufacturing a solderless electrical connection between a printed circuit board fitted with press-fit sockets and a component fitted with press-fit pins, the method comprising:

applying a protective layer on a section of a broadside of the printed circuit board adjacent to the component, wherein there are passage holes for the press-fit pins situated above the through holes of the press-fit sockets; and

pressing the press-fit pins with press-fit into through holes of the press-fit sockets.

9. The method of claim 8, further comprising:

wherein the protective layer is one of laminated and pressed on as a film, and prior to being laminated or pressed onto the printed circuit board, the passage holes are brought into congruence with the through holes when the protective layer is applied onto the printed circuit board.

10. The method of claim 9, wherein the passage holes are brought into congruence with aligned positioning holes in the protective layer and in the printed circuit board.

11. The method of claim 9, wherein the passage holes are brought into congruence with optical registers.

12. The method of claim 8, wherein the protective layer is one of laminated and pressed on as a film, and the passage holes are put into the protective layer after the protective layer has been applied onto the printed circuit board.