Stress isolated pressure sensing die
First Claim
1. Pressure sensing die to be mounted on a base, comprising:
- a sensing structure comprising;
a diaphragm structure with a deflectable sensing diaphragm whose deflection is representative of the pressure and sensing elements for detecting the deflection of the sensing diaphragm, a pedestal supporting the diaphragm structure, a linking structure for isolating at least some of the stresses caused by the mounting of the sensing die on the base from said deflectable sensing diaphragm, the linking structure being linked on one side to a bottom surface of the pedestal and to be linked, on an opposite side, to a top surface of the base, wherein the linking structure comprises at least one linking element extending between the base and the pedestal and having a mean cross-section smaller than the said bottom surface and top surface so as to constitute a small link between the base and the pedestal.
1 Assignment
0 Petitions
Accused Products
Abstract
The invention relates to a pressure sensing die to be mounted on a base, comprising: a sensing structure comprising: a diaphragm structure with a deflectable sensing diaphragm whose deflection is representative of the pressure and sensing elements for detecting the deflection of the sensing diaphragm, a pedestal supporting the diaphragm structure, a linking structure for isolating at least some of the stresses caused by the mounting of the sensing die on the base from said deflectable sensing diaphragm, the linking structure being linked on one side to a bottom surface of the pedestal and to be linked, on an opposite side, to a top surface of the base, wherein the linking structure comprises at least one linking element extending between the base and the pedestal and having a mean cross-section smaller than the said bottom surface and top surface so as to constitute a small link between the base and the pedestal. The invention further relates to a method of manufacturing such a sensing die.
39 Citations
35 Claims
-
1. Pressure sensing die to be mounted on a base, comprising:
-
a sensing structure comprising;
a diaphragm structure with a deflectable sensing diaphragm whose deflection is representative of the pressure and sensing elements for detecting the deflection of the sensing diaphragm, a pedestal supporting the diaphragm structure, a linking structure for isolating at least some of the stresses caused by the mounting of the sensing die on the base from said deflectable sensing diaphragm, the linking structure being linked on one side to a bottom surface of the pedestal and to be linked, on an opposite side, to a top surface of the base, wherein the linking structure comprises at least one linking element extending between the base and the pedestal and having a mean cross-section smaller than the said bottom surface and top surface so as to constitute a small link between the base and the pedestal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 19, 20, 21)
-
-
18. Pressure sensing die comprising:
-
a diaphragm structure with a deflectable sensing diaphragm, whose deflection is representative of the applied pressure; and
a pedestal comprising two linked parts connected with one or more narrow linking elements such that the linking element(s) isolates said deflectable sensing diaphragm from at least some of the stresses caused by mounting the pressure sensing die on a base.
-
-
22. Method of manufacturing a pressure sensing die to be mounted onto a base, comprising the following steps:
-
(a) providing a first wafer comprising a plurality of pressure sensing structures, each having a diaphragm structure on a pedestal, the diaphragm structure comprising a deflectable sensing diaphragm whose deflection is representative of a pressure and sensing elements for sensing the deflection of the sensing diaphragm;
(b) providing a second wafer;
(c) forming in the second wafer a plurality of linking structures corresponding respectively to the plurality of sensing structures, comprising a selective thinning down of a superficial layer of the second wafer so as to only leave in each linking structure at least one linking element supported by a linking base, wherein each linking element has a mean cross-section smaller than the surfaces of the corresponding pedestal and base with which the corresponding linking structure will be attached;
(d) attaching the second wafer with the first wafer; and
(e) cutting the attached first and second wafers so as to individualize at least one sensing die comprising one of the plurality of the sensing structures attached to a corresponding one of the plurality of linking structures;
wherein this linking structure isolates at least some of the stresses caused by a mounting of the sensing die on a base from said sensing diaphragm due to the small link constituted by the linking element. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
-
Specification