FLEXIBLE INDUCTIVE SENSOR

• US 20080007253A1
• Filed: 07/10/2006
• Published: 01/10/2008
• Est. Priority Date: 07/10/2006
• Status: Active Grant

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Takahata, Kenichi
• Granted Patent: US 7,498,802 B2
• Time in Patent Office: Days
• US Class Current: 324/207.22
• CPC Class Codes: G01D 5/2066 by movement of a single coil with respect to a single other coil

Abstract

An inductive sensor includes an inductor comprising conductive loops and at least one hinge mechanically coupling the loops. Operation of the hinge changes the position of the loops and causes a change in the inductance of the sensor. A sensor material may be oriented with respect to the loops so that a dimensional change of the sensor material operates the hinge and causes the change in the position of the loops.

Claims

1. A sensor, comprising:

an inductor comprising conductive loops and associated with an inductance;

one or more hinges mechanically coupling one or more pairs of the loops; and

a sensor material configured to respond to a parameter of interest by a dimensional change of the sensor material, the sensor material oriented with respect to the loops so that the dimensional change of the sensor material causes a change in position of at least a first one of the loops relative to at least a second one of the loops and produces a change in the inductance of the inductor.

2. The sensor of claim 1, wherein at least one of the loops is disposed on a flexible substrate.

3. The sensor material of claim 1, wherein the one or more hinges comprise folds of a flexible material.

4. The sensor of claim 1, wherein the loops and the hinges are disposed on a unitary substrate.

5. The sensor of claim 4, wherein the unitary substrate is flexible and the hinges comprise thinned portions of the unitary substrate.

6. The sensor of claim 1, further comprising a latching mechanism configured to orient the first loop at an initial angle with respect to the second loop.

7. The sensor of claim 1, wherein:

the loops are oriented in a substantially parallel configuration having a distance between each pair of parallel loops; and

the change in position involves a change in distance between the parallel loops.

8. The sensor of claim 1, wherein:

at least two of the loops are oriented at an angle to one another; and

the change in position involves a change in the angle.

9. The sensor of claim 1, wherein the sensor material is disposed between at least some of the loops.

10. The sensor of claim 1, wherein the sensor material comprises hydrogel.

11. The sensor of claim 1, wherein at least one loop is disposed on a substrate having perforations configured to expose the sensor material to the parameter of interest.

12. The sensor of claim 1, wherein the parameter of interest comprises at least one of temperature, moisture, pH, fluid flow, salinity, solvent composition, glucose concentration, electric field, light, and ion concentration.

13. The sensor of claim 1, wherein the sensor includes a capacitor electrically coupled to the inductor to form a resonant circuit, wherein a change in the parameter of interest causes a change in a resonance characteristic of the resonant circuit.

14. A sensor, comprising

an inductor comprising conductive loops, each conductive loop disposed on a planar substrate;

and

one or more hinges mechanically coupling at least one pair of the conductive loops so that operation of the one or more hinges changes the angular orientation of the loops, causing a corresponding change in the inductance of the inductor.

15. The sensor of claim 14, further comprising a sensor material configured to respond to a parameter of interest by a dimensional change of the sensor material, the sensor material oriented with respect to the loops so that the dimensional change of the sensor material causes operation of the one or more hinges.

16. The sensor of claim 15, wherein the sensor material is disposed between the conductive loops.

17. A sensor system comprising:

an inductive sensor, comprising;

an inductor comprising conductive loops and associated with an inductance;

one or more hinges mechanically coupling one or more pairs of the loops; and

a sensor material configured to respond to a parameter of interest by a dimensional change of the sensor material, the sensor material oriented with respect to the loops so that the dimensional change of the sensor material causes a change in position of at least a first one of the loops relative to at least a second one of the loops and produces a change in the inductance of the inductor; and

sensor circuitry electrically coupled to the inductor to form a resonant circuit having one or more resonance characteristics dependent on the inductance; and

an interrogator configured to detect a change in the resonance characteristics of the resonant circuit.

18. The sensor system of claim 17, wherein the interrogator is wirelessly coupled to the inductive sensor.

19. A method for making an inductive sensor, comprising:

forming a first loop of electrically conductive material on a first portion of a planar substrate, the substrate having at least a first portion, a second portion, and a flexible hinge portion connecting the first and second portions;

forming a second loop of electrically conductive material on the second portion of the substrate, the second loop electrically coupled to the first loop;

orienting a sensor material with respect to the substrate, the sensor material configured to respond to a parameter of interest by a dimensional change of the sensor material; and

folding the substrate at the hinge portion so that the sensor material is disposed between the first loop and the second loop and the first and second loops form coils of an inductor.

20. The method of claim 19, further comprising perforating the planar substrate to allow exposure of the sensor material to the parameter of interest.

21. The method of claim 19, further comprising forming electrodes on the planar substrate, the electrodes configured to form opposing plates of a capacitor when the planar substrate is folded, the capacitor electrically coupled with the inductor to form a resonant circuit.

22. The method of claim 21, wherein the opposing plates of the capacitor are formed on opposing sides of the first or second portion of the substrate.

23. The method of claim 21, wherein at least one of the opposing plates is formed in sections to reduce eddy currents in the at least one plate.

24. The method of claim 21, wherein at least one of the opposing plates is formed inside one of the loops.

25. The method of claim 19, further comprising:

forming an additional loop of electrically conductive material on an additional portion of the substrate, the additional loop electrically coupled to the first and second loops, the substrate having an additional flexible hinge portion coupling the additional portion to the first or second portions; and

folding the substrate at the additional hinge.

26. The method of claim 19, wherein folding the substrate at the additional hinge comprises fan-folding the substrate.

27. The method of claim 19, further comprising depositing multiple loops of electrically conductive material on the first portion or the second portion, the multiple loops configured to form a multi-turn inductor when the substrate is folded.

28. The method of claim 19, wherein the planar substrate comprises a polyimide film.

29. The method of claim 19, wherein the hinge comprises a portion of the substrate having a thickness that is smaller relative to a thickness of the first or second portions.

30. The method of claim 19, wherein forming the first and second loops comprises forming the first and second loops using a photolithographic process.

31. The method of claim 19, further comprising:

forming a latching mechanism on the substrate; and

engaging the latching mechanism to latch the first and second portions in an initial angular orientation after folding.