×

Methods and systems for semiconductor testing using reference dice

  • US 20080007284A1
  • Filed: 07/05/2006
  • Published: 01/10/2008
  • Est. Priority Date: 07/05/2006
  • Status: Active Grant
First Claim
Patent Images

1. A system for semiconductor testing, comprising:

  • a test manager configured to determine a group of semiconductor dice in a wafer which can be assumed to respond similarly to testing, wherein said group includes less than all dice in said wafer, and configured to select at least one reference die from said group for testing differently than other dice in said group which were not selected as reference dice, wherein said at least one reference die includes less than all dice in said group.

View all claims
  • 7 Assignments
Timeline View
Assignment View
    ×
    ×