ELECTRONIC DEVICE AND METHOD OF FABRICATION OF A SAME

• US 20080008890A1
• Filed: 07/03/2007
• Published: 01/10/2008
• Est. Priority Date: 07/04/2006
• Status: Active Grant

• Current Assignee: Lite-On Technology Corporation
• Original Assignee: Lite-On Technology Corporation
• Inventors: Li, Te Wei
• Granted Patent: US 7,742,312 B2
• Time in Patent Office: Days
• US Class Current: 428/423.1
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H04M 1/0277 for a printed circuit board assembly
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2201/0394 Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2201/0999 Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins
• CPC Class Codes: H05K 2203/161 Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: Y10T 428/31504 Composite [nonstructural laminate]
• CPC Class Codes: Y10T 428/31551 Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]

Abstract

An electronic device and method of fabrication are provided. The electronic device comprises a substrate, a patterned conductive layer serving as an antenna layer formed on the outer surface of the substrate, electrically connected with a printed circuit board (PCB) for sending or receiving a wireless signal, wherein the substrate is placed between the patterned conductive layer and PCB. The patterned conductive layer may be electrically connected to the PCB through a hole in the substrate by a connecting piece. The substrate may be a housing of the electronic device.

Claims

1. An electronic device, comprising:

a substrate; and

a patterned conductive layer formed on an outer surface of the substrate and electrically connected to a control circuit to send or receive wireless signals, wherein the substrate is between the patterned conductive layer and the control circuit.

2. The electronic device of claim 1, wherein the substrate comprises a housing.

3. The electronic device of claim 2, wherein the housing comprises polymer.

4. The electronic device of claim 1, further comprising:

a protective layer formed on the patterned conductive layer; and

a color layer formed between the patterned conductive layer and the protective layer.

5. The electronic device of claim 4, wherein the protective layer comprises ultraviolet curved coat or polyurethane.

6. The electronic device of claim 1, further comprising a connective piece and the substrate having a hole therethough, the patterned conductive layer electrically connected to the control circuit by the connective piece through the hole.

7. The electronic device of claim 6, wherein the connective piece comprises metal.

8. The electronic device of claim 1, wherein the patterned conductive layer is formed by physical vapor deposition or screen printing.

9. The electronic device of claim 1, wherein the patterned conductive layer comprises formation of multilayer to send or receive various wavelength or frequency of wireless signal.

10. The electronic device of claim 1, wherein the patterned conductive layer has a resistance of about 0.1 Ω

˜

20 Ω

.

11. A method of fabricating an electronic device, comprising:

providing a substrate;

forming a patterned conductive layer on the substrate; and

providing a connective piece to electrically connect the patterned conductive layer and a control circuit.

12. The method of claim 11, wherein the substrate comprises a housing.

13. The method of claim 12, wherein the housing comprises polymer.

14. The method of claim 11, wherein forming the patterned conductive layer further comprises:

forming a conductive layer on the substrate; and

forming the patterned conductive layer by using laser carving.

15. The method of claim 11, wherein forming the patterned conductive layer further comprises:

forming a covering layer on a portion of the substrate;

forming a conductive layer on the substrate and the covering layer; and

removing the covering layer and the conductive layer on the covering layer to form the patterned conductive layer.

16. The method of claim 15, wherein the covering layer comprises adhesive film, painting layer or photoresist.

17. The method of claim 11, further forming a color layer and a protective layer on the patterned conductive layer in sequence.

18. The method of claim 11, wherein the substrate is between the control circuit and the patterned conductive layer and has at least one hole therethrough by the connective piece to electrically connect the patterned conductive layer with the control circuit.

19. The method of claim 11, further comprising disposing a color layer on the substrate so as to form the substrate between the patterned conductive layer and the color layer.