Method of manufacturing a sticker type antenna

• US 20080010809A1
• Filed: 07/14/2006
• Published: 01/17/2008
• Est. Priority Date: 07/14/2006
• Status: Active Grant

• Current Assignee: Auden Techno Corp.
• Original Assignee: Auden Techno Corp.
• Inventors: Huang, Tung-Liang, Lin, Chun-Wei
• Granted Patent: US 7,412,765 B2
• Time in Patent Office: Days
• US Class Current: 29/600
• CPC Class Codes: H01Q 1/00 Details of, or arrangements associated with, antennas arrangements for varying orientation of directional pattern H01Q3/00
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/041 by using a die for cutting the conductive material
• CPC Class Codes: H05K 3/241 characterised by the electroplating method; means therefor, e.g. baths or apparatus
• CPC Class Codes: H05K 3/244 Finish plating of conductors, especially of copper conductors, e.g. for pads or lands selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3457, e.g. by plating H05K3/3473
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A method of manufacturing a sticker type antenna, in which a copper foil of 0.017 mm by thickness is stuck to a layer of releasable film in advance, in order that the copper foil can bear the pulling force in a brush electroplating process to thereby substitute the conventional beryllium copper of a larger thickness. The copper foil after brush electroplating undergoes punching and cutting for forming a pattern and is stuck to a semi-finished product of Mylar, hence the copper foil is stuck onto the back side of the Mylar layer; then the Mylar layer with the copper foil is separated from the releasable film, then the back side of the Mylar layer is applied with adhesive and again is stuck to the releasable film; after punching and cutting the Mylar layer for patterning and edging, a sticker type antenna is made.

Claims

1. A method of manufacturing a sticker type antenna, said method comprises steps of:

a. to cut a bare copper foil into a tape with a suitable width that is reeled and to be applied with adhesive and a releasable film;

b. to brush electroplate said copper foil having been processed, to plate with nickel firstly and with gold secondly;

c. to proceed to punching and cutting for forming a pattern on said copper foil having been brush electroplated, meantime to punch a positioning hole on said releasable film;

d. to apply on said patterned copper foil with a semi-finished product of a Mylar layer having adhesive thereon by the help of said positioning hole;

e. to stick said patterned copper foil onto a back side of said Mylar layer, then to separate said Mylar layer (with said copper foil) from said releasable film;

f. to apply adhesive on said back side of said Mylar layer (with said copper foil) again; and

g. by positioning of said positioning hole, to re-stick said Mylar layer (with said copper foil) to said releasable film;

h. to punch and cut said Mylar layer for patterning and edging to form said sticker type antenna.

2. The method of manufacturing a sticker type antenna as defined in claim 1, wherein manufacturing process of said semi-finished product of Mylar in said step “

d”

includes;

A1. to draw a positioning hole on said Mylar layer and said releasable film;

A2. to form said positioning hole by punching and cutting to form said semi-finished product.

3. The method of manufacturing a sticker type antenna as defined in claim 1, wherein thickness if said copper foil is 0.017 mm.

4. The method of manufacturing a sticker type antenna as defined in claim 1, wherein in said step “

a”

of said manufacturing method, a reel of copper foil, a reel of adhesive and a reel of releasable film are reeled out to be pressed together with a pressing cylinder set.

5. The method of manufacturing a sticker type antenna as defined in claim 1, wherein in said steps “

e”

to “

g”

of said manufacturing method, a copper foil, a Mylar layer and a releasable film pass through a reel of Mylar layer/copper foil and a reel of releasable film to separate said releasable film, then a reel of adhesive is reeled out to give said adhesive to apply to said back side of said Mylar layer (with said copper foil), and a pressing cylinder set is used to press said adhesive, said back side of said Mylar layer (with said copper foil) and said releasable film together.