Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices
First Claim
1. A modular package for a light emitting device, comprising:
- a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness, the leadframe further including an electrical lead extending laterally away from the second region; and
a thermoset package body on the leadframe and surrounding the first region, wherein the thermoset package body is on the top and bottom surfaces of the second region.
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Abstract
A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.
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Citations
52 Claims
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1. A modular package for a light emitting device, comprising:
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a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness, the leadframe further including an electrical lead extending laterally away from the second region; and
a thermoset package body on the leadframe and surrounding the first region, wherein the thermoset package body is on the top and bottom surfaces of the second region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of forming a package for a solid state light emitting device, comprising:
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providing a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness, the leadframe further including an electrical lead extending laterally away from the second region;
placing the leadframe into a mold having a mold cavity;
dispensing a thermoset precursor material into the mold cavity;
applying pressure to the mold; and
curing the thermoset precursor material to form a thermoset package body on the leadframe. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A modular package for a light emitting device, comprising:
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a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness, the leadframe further including an electrical lead extending laterally away from the second region and a leak barrier on a surface of the first region or a surface of the second region; and
a package body on the leadframe and surrounding the first region, wherein the package body is on the top and bottom surfaces of the second region, and wherein the package body is on the leak barrier. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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40. A method of forming a package for a solid state light emitting device, comprising:
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providing a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness, the leadframe further including an electrical lead extending laterally away from the second region and a leak barrier on a surface of the first region or the second region;
placing the leadframe into a mold having a mold cavity;
dispensing a precursor material into the mold cavity;
applying pressure to the mold; and
curing the precursor material to form a package body on the leadframe, wherein the package body is on the leak barrier. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52)
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Specification