PACKAGING STRUCTURE OF AN OPTICAL MOTION SENSOR

• US 20080012085A1
• Filed: 04/13/2007
• Published: 01/17/2008
• Est. Priority Date: 04/14/2006
• Status: Abandoned Application

• Current Assignee: Lite-On Semiconductor Corporation (Diodes Incorporated)
• Original Assignee: Lite-On Semiconductor Corporation (Diodes Incorporated)
• Inventors: Cheng, Chia-Chu, Huang, Kuo-Hsien, Chang, Po-Cheng
• Application Number:
  US11/734,960
• Publication Number:
  US 20080012085A1
• Time in Patent Office: Days
• US Class Current: 257/433
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

A packaging structure of an optical motion sensor includes a packaging substrate, an optical detection module, and a packaging mask. The optical detection module is provided on the packaging substrate and is electrically connected with the packaging substrate. The packaging mask is disposed on the packaging substrate to package the optical detection module. Further, the packaging mask is provided therein with a transparent body and a hole formed on the packaging mask. Via the above structure, light, passes through the transparent body inside the hole, and thus shines the optical detection module. In this way, the optical detection module is isolated from dirt in the air, thereby reducing possible damage or interference and reducing the volume of the packaging structure.

Claims

1. A packaging structure of an optical motion sensor, comprising:

a packaging substrate;

an optical detection module provided on the packaging substrate and electrically connected with the packaging substrate, the optical detection module including at least one transverse line and at least one longitudinal line of complementary metal-oxide-semiconductor (CMOS) linear scanning modules; and

a packaging mask provided on the packaging substrate to package the optical detection module, the packaging mask being provided therein with a transparent body and a hole formed on the packaging mask.

2. The packaging structure of an optical motion sensor according to claim 1, further comprising a main board base that is provided on the packaging substrate by means of Surface Mount Technology (SMT).

3. The packaging structure of an optical motion sensor according to claim 2, wherein the packaging substrate has at least one through hole, and the optical detection module is electrically connected with the main board base directly by means of a wiring process and passing through the at least one through hole.

4. The packaging structure of an optical motion sensor according to claim 1, wherein the packaging substrate is a printed circuit board (PCB), an aluminum substrate or a flexible printed circuit.

5. The packaging structure of an optical motion sensor according to claim 1, wherein the optical detection module is electrically connected with the packaging substrate by means of a wiring process.

6. The packaging structure of an optical motion sensor according to claim 1, wherein the optical detection module is comprised of complementary metal-oxide-semiconductor (CMOS) sensing chips.

7. The packaging structure of an optical motion sensor according to claim 1, wherein the hole is arranged to correspond to the optical detection module.

8. The packaging structure of an optical motion sensor according to claim 1, wherein the transparent body is a glass body, thereby protecting the optical detection module and isolating the optical detection module from dirt or impurities.

9. The packaging structure of an optical motion sensor according to claim 1, wherein the packaging mask is a packaging mask made of an opaque material.