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PACKAGING STRUCTURE OF AN OPTICAL MOTION SENSOR

  • US 20080012085A1
  • Filed: 04/13/2007
  • Published: 01/17/2008
  • Est. Priority Date: 04/14/2006
  • Status: Abandoned Application
First Claim
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1. A packaging structure of an optical motion sensor, comprising:

  • a packaging substrate;

    an optical detection module provided on the packaging substrate and electrically connected with the packaging substrate, the optical detection module including at least one transverse line and at least one longitudinal line of complementary metal-oxide-semiconductor (CMOS) linear scanning modules; and

    a packaging mask provided on the packaging substrate to package the optical detection module, the packaging mask being provided therein with a transparent body and a hole formed on the packaging mask.

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