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Thermally distributed integrated power amplifier module

  • US 20080012645A1
  • Filed: 07/14/2006
  • Published: 01/17/2008
  • Est. Priority Date: 07/14/2006
  • Status: Active Grant
First Claim
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1. An integrated power amplifier (PA) module formed on a substrate, comprising:

  • a first cluster of transistor cells and a first electrical circuit positioned in a first portion of the substrate;

    a second cluster of transistor cells and a second electrical circuit positioned in a second portion of the substrate and spaced apart from the first portion; and

    a combiner coupled to the first and second clusters to combine the output of the first and second clusters.

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