Pick and place machine with improved component placement inspection
First Claim
Patent Images
1. An image acquisition system for use in a pick and place machine, the system comprising:
- an imaging device for acquiring an image of an intended placement location of a component on a workpiece;
a position sensitive device disposed to provide an output indicative of a position of a placement head in the pick and place machine; and
wherein image device acquisition timing is determined by the output of the position sensitive device.
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Abstract
Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include using a position sensitive device that measures the position of the placement head relative to the workpiece as the placement head travels towards and away from the workpiece during a placement cycle. The output of this sensor is used to selectably trigger the acquisition of the images used to measure a placement characteristic of the component placement machine.
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4 Claims
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1. An image acquisition system for use in a pick and place machine, the system comprising:
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an imaging device for acquiring an image of an intended placement location of a component on a workpiece;
a position sensitive device disposed to provide an output indicative of a position of a placement head in the pick and place machine; and
wherein image device acquisition timing is determined by the output of the position sensitive device. - View Dependent Claims (2, 3, 4)
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Specification