Non-Peripherals Processing Control Module Having Improved Heat Dissipating Properties

• US 20080013270A1
• Filed: 08/03/2007
• Published: 01/17/2008
• Est. Priority Date: 10/22/2002
• Status: Active Grant

• Current Assignee: ATD Ventures, LLC
• Original Assignee: Jason Sullivan
• Inventors: Sullivan, Jason
• Granted Patent: US 7,817,412 B2
• Time in Patent Office: Days
• US Class Current: 361/683
• CPC Class Codes: G06F 1/16 Constructional details or arrangements
• CPC Class Codes: G06F 1/181 Enclosures for portable computers G06F1/1613
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H05K 5/02 Details

Abstract

The present invention features a non-peripherals-based processing control unit having an encasement module that is very small and durable compared to conventional computer encasement structures. The process control unit is capable of being incorporated into various devices and/or environments, of accepting applied and impact loads, of functioning as a load bearing structure, as well as being able to be processed coupled together with one or more processing control units to provide scaled processing power. The processing control unit of the present invention further features a unique method of cooling using natural convection, as well as utilizing known cooling means, such as liquid or thermoelectric cooling.

Claims

1. An encasement for a computer processing control unit comprising:

a main support chassis having one or more wall supports and one or more junction centers containing means for supporting a computer component therein; and

a dynamic back plane coupled to the main support chassis, wherein the dynamic back plane provides support for one or more computing components, and wherein the dynamic back plane comprises one or more ports for connecting said components.