TRANSFORMER COILS FOR PROVIDING VOLTAGE ISOLATION
First Claim
Patent Images
1. An integrated isolator system, comprising:
- a first integrated circuit chip containing functional circuitry;
a second integrated circuit chip containing functional circuitry;
a first transformer within the first integrated circuit chip for providing voltage isolation for the first integrated circuit chip;
a second transformer within the second integrated circuit chip for providing voltage isolation for the second integrated circuit chip; and
wherein the first transformer is interconnected with the second transformer via bond wires to provide voltage isolation between the first chip and the second chip.
2 Assignments
0 Petitions
Accused Products
Abstract
A circuit package providing voltage isolation includes at least one output and first circuitry located in a substrate of the circuit package for performing an operation. A transformer located in the metal layers of the circuit package provides voltage isolation between the first circuitry and the at least one output.
-
Citations
34 Claims
-
1. An integrated isolator system, comprising:
-
a first integrated circuit chip containing functional circuitry;
a second integrated circuit chip containing functional circuitry;
a first transformer within the first integrated circuit chip for providing voltage isolation for the first integrated circuit chip;
a second transformer within the second integrated circuit chip for providing voltage isolation for the second integrated circuit chip; and
wherein the first transformer is interconnected with the second transformer via bond wires to provide voltage isolation between the first chip and the second chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
-
12. An integrated isolator system, comprising:
-
a first integrated circuit chip containing functional CMOS circuitry;
a second integrated circuit chip containing functional CMOS circuitry;
a first transformer associated with the first integrated circuit chip for providing voltage isolation for the first integrated circuit chip, comprising;
a first primary coil located in a first metal layer of the first integrated circuit chip;
a first secondary coil located in a second metal layer of the first integrated circuit chip;
wherein the first primary coils and the first secondary coils are substantially non-overlapping;
a second transformer associated with the second integrated circuit chip for providing voltage isolation for the second integrated circuit chip;
a second primary coil located in a first metal layer of the second integrated circuit chip; and
a second secondary coil located in a second metal layer of the second integrated circuit chip;
wherein the second primary coils and the second secondary coils are substantially non-overlapping;
wherein the first transformer is interconnected with the second transformer via bond wires to provide voltage isolation between the first chip and the second integrated circuit chip. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
-
-
20. An integrated isolator, comprising:
-
first and second integrated circuit substrates;
each of said first and second substrates having contained on the surface thereof a lower transformer coil with an associated input;
each said lower transformer coil on said first and second substrates having a layer of dielectric material disposed thereover; and
a top conductive coupling layer disposed over each of said respective dielectric layers on said first and second substrates to couple energy from one of said inputs of said respective lower transformer coils on said first and second substrates to the other of said inputs. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
-
Specification