METHOD FOR PROCESSING OUTER PERIPHERY OF SUBSTRATE AND APPARATUS THEREOF

• US 20080017613A1
• Filed: 07/17/2007
• Published: 01/24/2008
• Est. Priority Date: 07/09/2004
• Status: Abandoned Application

• Current Assignee: Sekisui Chemical Company Limited (Sekisui)
• Original Assignee: Sekisui Chemical Company Limited (Sekisui)
• Inventors: Nogami, Mitsuhide, Hasegawa, Taira, Kunugi, Syunsuke
• Application Number:
  US11/779,142
• Publication Number:
  US 20080017613A1
• Time in Patent Office: Days
• US Class Current: 216/58
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H01L 21/6708 using mainly spraying means, e.g. nozzles

Abstract

To enhance a removing efficiency of unnecessary matters on a peripheral part of a substrate (90) such as wafer and to prevent particles from adhering to the substrate (90).

A reactive gas is jetted out from a jet nozzle (75) toward a target spot (P) of the peripheral part of the substrate (90) in such a way that the reactive gas is made to flow approximately along a circumferential direction at the target spot (P) of the substrate (90) as viewed from a direction orthogonal to the substrate (90). Gases near the target spot (P) are sucked by a suction nozzle (76) along approximately the circumferential direction at a downstream side of the target spot (P).

Claims

1. An apparatus for removing an unnecessary matter on an outer peripheral part of a substrate by a reactive gas, the apparatus comprising:

a jet nozzle that jets out the reactive gas toward a target spot of the outer peripheral part, in such a way that a jetting direction of the reactive gas is approximately along a circumferential direction at the target spot in the substrate as viewed from a direction orthogonal to an imaginary plane where the substrate should be located.

2. The apparatus according to claim 1 wherein the jet nozzle is composed of a light transmissive material.

3. The apparatus according to claim 1 wherein the jet nozzle is slanted so as to approach to the imaginary plane toward a distal end of the jet nozzle as viewed from a direction parallel with the imaginary plane.

4. The apparatus according to claim 1 wherein the jet nozzle is slightly slanted relative to the circumferential direction at the target spot toward an inner side of the substrate as viewed from the direction orthogonal to the imaginary plane.

5. An apparatus for removing an unnecessary matter on an outer peripheral part of a substrate by contacting a reactive gas with the outer peripheral part, the apparatus comprising:

a suction nozzle that sucks gases near a target spot of the outer peripheral part in such a way that a sucking direction of the suction nozzle is approximately along a circumferential direction at the target spot in the substrate as viewed from a direction orthogonal to an imaginary plane where the substrate should be located.

6. The apparatus according to claim 5 wherein the suction nozzle is slanted so as to approach to the imaginary plane toward a distal end of the suction nozzle as viewed from a direction parallel with the imaginary plane.

7. An apparatus for removing an unnecessary matter on an outer peripheral part of a substrate by a reactive gas, the apparatus comprising:

a jet nozzle that jets out the reactive gas toward a target spot of the outer peripheral part, in such a way that a jetting direction of the reactive gas is approximately along a circumferential direction at the target spot in the substrate as viewed from a direction orthogonal to an imaginary plane where the substrate should be located; and

a suction nozzle that sucks gases near the target spot at a downstream side of the target spot in such a way that a sucking direction of the suction nozzle is approximately along a direction that is the same as the jetting direction as viewed from the orthogonal direction.

8. The apparatus according to claim 7 wherein distal ends of the jet nozzle and the suction nozzle are disposed so as to approximately face each other in the circumferential direction by interposing the target spot as viewed from the orthogonal direction.

9. The apparatus according to claim 7 wherein the bore diameter of the suction nozzle is larger than that of the jet nozzle.

10. The apparatus according to claim 7 further comprising a radiant heater that locally irradiates a thermal light toward the target spot through between the distal ends of the jet nozzle and the suction nozzle.

11. The apparatus according to claim 10 further comprising a rotation device that rotates the substrate in a direction from the jet nozzle toward the suction nozzle relative to the nozzles.

12. The apparatus according to claim 11 wherein the local radiation position by the radiant heater is offset toward the jet nozzle rather than the suction nozzle.

13. The apparatus according to claim 10 wherein the radiant heater irradiates the thermal light toward the target spot from a direction declined radially outwardly of the substrate.

14. The apparatus according to claim 10 wherein the radiant heater has an irradiating portion of the radiant heater, the apparatus further comprising a moving mechanism that moves the irradiating portion in another plane orthogonal to the imaginary plane while directing the irradiating portion toward the target spot.

15. The apparatus according to claim 10 further comprising:

a stage having a support surface for contacting the substrate and for supporting the substrate thereon; and

a heat absorber incorporated into the stage and absorbing heat from the support surface.

16. A method for removing an unnecessary matter on an outer peripheral part of a substrate by a reactive gas, the method comprising:

jetting out the reactive gas toward a target spot of the outer peripheral part of the substrate approximately along a circumferential direction at the target spot in the substrate as viewed from a direction orthogonal to the substrate.

17. A method for removing an unnecessary matter on an outer peripheral part of a substrate by a reactive gas, the method comprising:

contacting the reactive gas with the target spot in the outer peripheral part of the substrate; and

sucking gases near the target spot approximately along a circumferential direction at the target spot in the substrate as viewed from a direction orthogonal to the substrate.

18. A method for removing an unnecessary matter on an outer peripheral part of a substrate by a reactive gas, the method comprising:

jetting out the reactive gas toward a target spot of the outer peripheral part of the substrate approximately along a circumferential direction at the target spot in the substrate as viewed from a direction orthogonal to the substrate; and

sucking gases near the target spot at a downstream side of the target spot to a direction that is substantially the same as the jetting direction as viewed from a direction orthogonal to the substrate.