Capillary underflow integral heat spreader
First Claim
1. A cooling device, comprising:
- a thermally conductive body having a first mating surface;
a solder wettable material disposed in a first pattern over at least a portion of the first mating surface; and
a reflowable solder material disposed at the first mating surface, a portion of the solder material configured to be capable of contacting a second mating surface of an adjacently disposed device, and when melted, forming a single flow front through a bond line gap between the first and second mating surfaces.
1 Assignment
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Accused Products
Abstract
A cooling device including a thermally conductive body with a first mating surface, a first solder wettable material disposed in a pattern at a portion of the first mating surface, and a reflowable solder material disposed at the first mating surface. A portion of the solder material is configured to be capable of contacting an adjacently disposed second mating surface, and when melted, to form a single flow front through a bond line gap between the first mating surface of the cooling device and the second mating surface of, for example, a thermal component.
A mating surface of the cooling device is positioned adjacent to a mating surface of a thermal component and the solder material is heated at least to its melting point. The solder material is maintained in a molten state until it has flowed into and substantially filled a bond line gap between the mating surface of the cooling device and the mating surface of the thermal component, and then cooled below its melting point, physically and/or thermally coupling the cooling device and the thermal component.
38 Citations
25 Claims
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1. A cooling device, comprising:
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a thermally conductive body having a first mating surface; a solder wettable material disposed in a first pattern over at least a portion of the first mating surface; and a reflowable solder material disposed at the first mating surface, a portion of the solder material configured to be capable of contacting a second mating surface of an adjacently disposed device, and when melted, forming a single flow front through a bond line gap between the first and second mating surfaces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An assembly method, comprising:
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disposing a cooling device adjacent to a thermal component, the cooling device comprising; a thermally conductive body having a first mating surface; a solder wettable material disposed in a first pattern over at least a portion of the first mating surface; and a reflowable solder material disposed at the first mating surface, a portion of the solder material configured to contact a second mating surface of the thermal component, and when melted, to form a single flow front through a bond line gap between the first and second mating surfaces; heating the solder material at least to its melting point; maintaining the solder material in a molten state until it substantially fills the bond line gap; and reducing the temperature of the solder material below its melting point. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21)
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22. An assembly, comprising:
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a package substrate; at least one semiconductor device coupled with the substrate, the semiconductor device having a first mating surface; a cooling device thermally coupled with the semiconductor device, the cooling device comprising; a thermally conductive body having a second mating surface; a concavity formed into the second mating surface; a solder wettable material disposed in a first pattern over at least a portion of the second mating surface; and a reflowable solder material substantially filling a gap between the first and second mating surfaces. - View Dependent Claims (23, 24, 25)
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Specification