DISPLAY DEVICE

• US 20080018626A1
• Filed: 07/20/2007
• Published: 01/24/2008
• Est. Priority Date: 07/21/2006
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kang, Jung-Tee, Ha, Jin-Ho, Kwon, Yoon-Soo, Kim, Joo-Young, Yang, Yong-Seok
• Granted Patent: US 7,839,396 B2
• Time in Patent Office: Days
• US Class Current: 345/204
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 2203/60 Temperature independent
• CPC Class Codes: H05K 7/20963 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20972 takes precedence

Abstract

In accordance with an embodiment of the present invention, a display device is provided that includes a display panel configured to display an image, a plurality of driver integrated circuit packages that include a base film and an integrated circuit chip mounted on the base film and of which one side is attached to an edge of the display panel, and a supporting member that fixedly supports the display panel. The supporting member includes a supporting body that fixedly supports the display panel, and a contact heat dissipating portion that protrudes from the supporting body and comes in contact with the driver integrated circuit packages in an area where the integrated circuit chip is formed.

Claims

1. A display device, comprising:

a display panel configured to display an image;

a plurality of driver integrated circuit packages that include a base film and an integrated circuit chip mounted on the base film and of which one side is attached to an edge of the display panel; and

a supporting member that fixedly supports the display panel,

wherein the supporting member comprises;

a supporting body that fixedly supports the display panel, and

a contact heat dissipating portion that protrudes from the supporting body and comes in contact with the driver integrated circuit packages in an area where the integrated circuit chip is formed.

2. The device of claim 1, wherein the contact heat dissipating portion comes in contact with an opposite side of a surface of the base film where the integrated circuit chip is mounted.

3. The device of claim 2, wherein the supporting body comprises:

a front portion that forms a display window for exposing a front surface of the display panel; and

a lateral portion that extends from the front portion.

4. The device of claim 3, further comprising:

a supporting frame that comprises;

a panel supporting portion that supports edges of the display panel and faces the front portion of the supporting member; and

a lateral portion that extends from the panel supporting portion and faces the lateral portion of the supporting member.

5. The device of claim 4, wherein the driver integrated circuit packages, which are disposed between the front portion of the supporting member and the panel supporting portion of the supporting frame and between the lateral portion of the supporting member and the lateral portion of the supporting frame, are elastically curved.

6. The device of claim 5, wherein the driver integrated circuit packages include curved outer surfaces, and wherein the contact heat dissipating portions of the supporting member press against the curved outer surfaces of the driver integrated circuit packages.

7. The device of claim 4, wherein the contact heat dissipating portions protrude from the lateral portion of the supporting member towards the lateral portion of the supporting frame so as to come in contact with the base film in an area where the integrated circuit chip is mounted.

8. The device of claim 7, wherein the supporting frame further comprises a circuit chip protecting groove that is formed on a surface of the lateral portion facing the contact heat dissipating portion.

9. The device of claim 4, wherein the contact heat dissipating portion protrudes from the front portion of the supporting member towards the panel supporting portion of the supporting frame so as to come in contact with the base film in an area where the integrated circuit chip is mounted.

10. The device of claim 9, wherein the supporting frame further comprises a circuit chip protecting groove that is formed on a surface of the panel supporting portion facing the contact heat dissipating portion.

11. The device of claim 4, further comprising a printed circuit board connected to a second side of one or more of the plurality of driver integrated circuit packages.

12. The device of claim 11, wherein the printed circuit board is located between the lateral portion of the supporting frame and the lateral portion of the supporting member.

13. A display device, comprising:

a display panel configured to display an image;

a receiving member configured to receive a rear surface of the display panel;

a control circuit board disposed at a rear surface of the receiving member and includes an integrated circuit chip; and

a cover member configured to join with the receiving member to cover the control circuit board,

wherein the cover member comprises;

a cover body; and

a thermal conductive portion protruding from the cover body towards the control circuit board.

14. The device of claim 13, further comprising a heat dissipating pad located between the thermal conductive portion of the cover member and the integrated circuit chip of the control circuit board.

15. The device of claim 14, wherein the heat dissipating pad has a thickness of between about 0.5 mm to about 2.0 mm.

16. The device of claim 14, wherein the cover member includes a material containing a metal component having high thermal conductivity.