MEMS Device with a Closed Cellular Core Sandwiched Structure
First Claim
1. A micro-mirror device comprising:
- a mirrored platform including a sandwich structure having an upper uniform, smooth and uninterrupted layer;
a core layer having a closed cellular structure; and
a lower uniform, smooth and uninterrupted layer;
a hinge structure enabling the mirrored platform to rotate about an axis of rotation above a substrate; and
attracting means for rotating the mirrored platform about the axis of rotation.
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Accused Products
Abstract
A large micro-mirror, e.g. 3 mm by 4 mm, in accordance with the present invention has sufficient rigidity to ensure a low mirror curvature, e.g. a radius of curvature greater than 5 meters, and a low mass in order to ensure a high oscillation frequency, e.g. greater than 1000 Hz. A method of making the micro-mirror utilizes bulk micro-machining technology, which enables the manufacture of a honeycomb structure sandwiched between two solid and smooth silicon layers without any indentations or holes. The honeycomb sandwich structure provides the rigidity and low mass needed to obtain a micro-mirror with a low mirror curvature and high resonant frequency.
16 Citations
20 Claims
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1. A micro-mirror device comprising:
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a mirrored platform including a sandwich structure having an upper uniform, smooth and uninterrupted layer;
a core layer having a closed cellular structure; and
a lower uniform, smooth and uninterrupted layer;a hinge structure enabling the mirrored platform to rotate about an axis of rotation above a substrate; and attracting means for rotating the mirrored platform about the axis of rotation. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 19, 20)
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12. A method of manufacturing the micro-mirror device, comprising the steps of:
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a) providing a first semiconductor on insulator structure including a first semiconductor layer, a first insulator layer, and a second semiconductor layer; b) etching the second semiconductor layer to form a core layer having closed cellular structures; c) providing a second semiconductor on insulator structure including a third semiconductor layer and a second insulator layer; d) bonding the second semiconductor on insulator structure to the first semiconductor on insulator structure forming a sandwich structure having an upper uniform, smooth and uninterrupted skin layer, and a lower uniform, smooth and uninterrupted skin layer, with the core layer therebetween; e) providing a substrate with an electrode mounted thereon; f) mounting the sandwich structure on the substrate above the electrode; and g) etching the sandwich structure to form hinges and a rotatable platform. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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Specification