Multi-Layer Capacitor And Integrated Circuit Module

• US 20080019074A1
• Filed: 06/25/2004
• Published: 01/24/2008
• Est. Priority Date: 06/25/2004
• Status: Active Grant

• Current Assignee: Technische Universitat Braunschweig Carolo-Wilhelmina
• Original Assignee: Technische Universitat Braunschweig Carolo-Wilhelmina
• Inventors: Heyen, Johann, Jacob, Arne
• Granted Patent: US 7,684,170 B2
• Time in Patent Office: Days
• US Class Current: 361/301.4
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors

Abstract

The invention relates to a multi-layer capacitor (1) comprising several electrically insulating layers that are stacked on top of one another, in addition to parallel first electrode plates (2) and second electrode plates (3) that are arranged between the insulating layers. The first and second electrode plates (2, 3) are located alternately one on top of the other, separated by an intervening insulating layer. Said capacitor also comprises at least one first connecting line (4a), which extends perpendicularly through the layers, is connected to the first electrode plates (2) and is insulated in relation to the second electrode plates (3) and second connecting lines (5), which extend perpendicularly through the layers, are connected to the second electrode plates (3) and are insulated in relation to the first electrode plates (2). The first connecting line (4a) extends centrally through the stacked first and second electrode plates (2, 3) and is designed to carry a high-frequency signal.

Claims

1. A multi-layer capacitor (1) comprising a number of electrically insulating layers stacked on top of one another, first and second electrode plates (2, 3) arranged in parallel with one another between the insulating layers, wherein the first and second electrode plates (2, 3) are arranged spaced apart from one another above one another alternating with an intermediate insulating layer, and with at least one first connecting line (4a) extending perpendicularly through the layers, which is connected to the first electrode plates (2) and is insulated from the second electrode plates (3) , and with second connecting lines (5) extending perpendicularly through the layers, which are connected to the second electrode plates (3) and are insulated from the first electrode plates (2), characterized in that a first connecting line (4a) provided for application of a radio-frequency signal extends centrally through the stacked first and second electrode plates (2, 3).

2. The multi-layer capacitor (1) as claimed in claim 1, characterized in that the second connecting lines (5) are arranged distributed over the outer circumference of the first electrode plates (2) and the second electrode plates (3) protrude over the outer circumference of the first electrode plates (2).

3. The multi-layer capacitor (1) as claimed in claim 1, characterized in that the first connecting line (4a) extends centrally through the stacked first and second electrode plates (2, 3).

4. The multi-layer capacitor (1) as claimed in claim 3, characterized in that further first connecting lines (4) are arranged distributed symmetrically around the central first connecting line (5) on a circumference.

5. The multi-layer capacitor (1) as claimed in claim 4, characterized in that further second connecting lines (5) are arranged distributed on the circumference of the further first connecting lines (4)

6. The multi-layer capacitor (1) as claimed in claim 4, characterized in that the further first connecting lines (4) are offset with respect to the second connecting lines (5).

7. The multi-layer capacitor (1) as claimed in claim 1, characterized in that the multi-layer capacitor (1) is terminated with first electrode plates (2) at the top and the bottom.

8. The multi-layer capacitor (1) as claimed in claim 1, characterized in that the first and second electrode plates (2, 3) are circular.

9. The multi-layer capacitor (1) as claimed in claim 1, characterized in that further first and/or second connecting lines (4, 5) extend through the stacked first and second electrode plates (2, 3) and are electrically conductively connected to associated electrode plates (2, 3) for forming parallel and/or serially connected blocking capacitances.

10. The multi-layer capacitor (1) as claimed in claim 1, characterized in that the further first and the second connecting lines (4, 5) are electrically interconnected with the first and second electrode plates (2, 3) in such a manner that blocking capacitances connected in series with the signal-conducting first connecting line (4a) are formed.

11. An integrated circuit module comprising a carrier substrate and at least one integrated circuit on the carrier substrate, characterized in that the carrier substrate is multi-layered, at least one multi-layer capacitor (1) comprising a number of electrically insulating layers stacked on top of one another, first and second electrode plates (2, 3) arranged in parallel with one another between the insulating layers, wherein the first and second electrode plates (2, 3) are arranged spaced apart from one another above one another alternating with an intermediate insulating layer, and with at least one first connecting line (4a) extending perpendicularly through the layers, which is connected to the first electrode plates (2) and is insulated from the second electrode plates (3), and with second connecting lines (5) extending perpendicularly through the layers, which are connected to the second electrode plates (3) and are insulated from the first electrode plates (2), characterized in that a first connecting line (4a) provided for application of a radio-frequency signal extends centrally through the stacked first and second electrode plates (2, 3), is integrated in the carrier substrate and the first and second connecting lines (4, 5) are wired directly or by means of wire or flip-chip connections to at least one of the integrated circuits.