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Multi-Layer Capacitor And Integrated Circuit Module

  • US 20080019074A1
  • Filed: 06/25/2004
  • Published: 01/24/2008
  • Est. Priority Date: 06/25/2004
  • Status: Active Grant
First Claim
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1. A multi-layer capacitor (1) comprising a number of electrically insulating layers stacked on top of one another, first and second electrode plates (2, 3) arranged in parallel with one another between the insulating layers, wherein the first and second electrode plates (2, 3) are arranged spaced apart from one another above one another alternating with an intermediate insulating layer, and with at least one first connecting line (4a) extending perpendicularly through the layers, which is connected to the first electrode plates (2) and is insulated from the second electrode plates (3) , and with second connecting lines (5) extending perpendicularly through the layers, which are connected to the second electrode plates (3) and are insulated from the first electrode plates (2), characterized in that a first connecting line (4a) provided for application of a radio-frequency signal extends centrally through the stacked first and second electrode plates (2, 3).

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