Epoxy Resin, Epoxy Resin Composition And Cured Product Thereof

• US 20080021173A1
• Filed: 06/24/2005
• Published: 01/24/2008
• Est. Priority Date: 06/25/2004
• Status: Abandoned Application

• Current Assignee: Nippon Kayaku Company Limited
• Original Assignee: Nippon Kayaku Company Limited
• Inventors: Oshimi, Katsuhiko, Nakanishi, Masataka, Akatsuka, Yasumasa, Tanaka, Ryutaro
• Application Number:
  US11/629,313
• Publication Number:
  US 20080021173A1
• Time in Patent Office: Days
• US Class Current: 525/390
• CPC Class Codes: C08G 59/08 from phenol-aldehyde condensates

Abstract

The present invention relates to an epoxy resin whose cured product has a high heat resistance, and directed to provide an epoxy resin improved in adhesiveness and toughness in comparison with the conventional highly heat resistant epoxy resin. Specifically disclosed is an epoxy resin obtainable by glycidylation of a mixture of
(a) a phenol compound condensate which is a condensate of phenols and glyoxal and contains not less than 80% (area % by a gel permeation chromatography) of a compound represented by the formula (1):
(wherein R represents each independently a hydrogen atom, (C₁-C₁₅) hydrocarbon group or trifluoromethyl group); and (b) a phenol compound other than (a) or a phenol resin.

Claims

1. An epoxy resin obtained by glycidylation of a mixture of:

(a) a phenol compound condensate which is a condensate of phenols and glyoxal and contains not less than 80% (area % by a gel permeation chromatography) of a compound represented by the formula (1);

(wherein R represents each independently hydrogen atom, (C₁-C₁₅) hydrocarbon group or trifluoromethyl group); and

(b) a phenol compound other than (a) or a phenol resin.

2. The epoxy resin according to claim 1, wherein the component (b) is a phenol-aralkyl resin.

3. The epoxy resin according to claim 1 or 2, characterized by that a form thereof is crystalline powder.

4. The epoxy resin according to claim 3, wherein melting point thereof is 80 to 170°

C.

5. The epoxy resin according to any one of claims 1 to 4, wherein a ratio of the component (b) is not more than 25% by weight relative to the total amount of a mixture of the component (a) and the component (b).

6. The epoxy resin according to any one of claims 1 to 5, wherein the component (b) is a biphenyl type phenol-aralkyl resin.

7. A process for producing an epoxy resin, characterized by that a mixture of the component (a) and the component (b) described in claim 1 is glycidylated with an epihalohydrin.

8. The process for producing an epoxy resin according to claim 7, characterized by that a mixture composed of 65 to 95% by weight of the component (a) and 35 to 5% by weight of the component (b) relative to the total amount of the component (a) and the component (b) is glycidylated with an epihalohydrin, then an epoxy resin crystal is separated out from the resultant reaction liquid.

9. The process for producing an epoxy resin according to claim 8, characterized by that water is added in order to separate out an epoxy resin crystal.

10. The process for producing an epoxy resin according to any one of claims 7 to 9, characterized by that an epoxy resin crystal is obtained by distilling off solvents contained in an epoxy resin crystal dispersion obtained by separating out an epoxy resin crystal.

11. An epoxy resin composition characterized by comprising the epoxy resin according to any one of claims 1 to 6 and a curing agent.

12. A cured product obtained by curing the epoxy resin composition according to claim 11.

13. An epoxy resin composition, characterized by comprising the epoxy resin according to any one of claims 1 to 6 and a compound having an ethylenically unsaturated group.

14. The epoxy resin according to any one of claims 1 to 4, wherein a ratio of the component (b) is not more than 35% by weight relative to the total amount of a mixture of the component (a) and the component (b).