Imaging thin film structures by scanning acoustic microscopy
First Claim
1. Apparatus for Scanning Acoustic Microscopy (SAM) of a semiconductor device with an acoustic probe, said semiconductor device including a substrate having a first surface and a second surface with bonding features secured to said first surface and with acoustic transmission fluid retained in contact with said second surface;
- said apparatus comprising;
an environment surrounding said first surface, said environment comprising an atmosphere selected from a gas and a vacuum;
a barrier in contact with one of said first surface and said second surface sealed to prevent said acoustic transmission fluid from being admitted to said environment surrounding said first surface; and
an acoustic scanning probe positioned confronting said second surface of said semiconductor device extending into said acoustic transmission fluid retained in contact with said second surface.
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Accused Products
Abstract
A method and apparatus for Scanning Acoustic Microscopy (SAM) for testing of a semiconductor device having a first surface and a second surface with bonding features secured to said first surface are provided. An impervious fixture comprising a dam or a tank retains acoustic transmission fluid in contact with the second surface. Acoustic transmission fluid is excluded from admission to the space surrounding the bonding features where an atmosphere of gas or a vacuum is provided by isolating the first surface from the acoustic transmission fluid either by providing a sealed chamber protecting the first surface or by providing a dam surrounding the second surface.
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Citations
20 Claims
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1. Apparatus for Scanning Acoustic Microscopy (SAM) of a semiconductor device with an acoustic probe, said semiconductor device including a substrate having a first surface and a second surface with bonding features secured to said first surface and with acoustic transmission fluid retained in contact with said second surface;
- said apparatus comprising;
an environment surrounding said first surface, said environment comprising an atmosphere selected from a gas and a vacuum; a barrier in contact with one of said first surface and said second surface sealed to prevent said acoustic transmission fluid from being admitted to said environment surrounding said first surface; and an acoustic scanning probe positioned confronting said second surface of said semiconductor device extending into said acoustic transmission fluid retained in contact with said second surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
- said apparatus comprising;
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13. Apparatus for Scanning Acoustic Microscopy (SAM) of a semiconductor device having a first surface and a second surface with bonding features secured to said first surface comprising:
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a tank for retaining acoustic transmission fluid; an impervious fixture retained in sealed contact with said first surface defining an interior space surrounding said bonding features, said impervious fixture being filled with an atmosphere selected from the group consisting of a vacuum, air and gas and being sealed to exclude said acoustic transmission fluid from admission to said interior space.
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14. A method of testing a semiconductor device employing Scanning Acoustic Microscopy (SAM) of a semiconductor device having a first surface and a second surface with bonding features secured to said first surface comprising:
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retaining acoustic transmission fluid in contact with said second surface; providing a atmosphere surrounding said first surface, said atmosphere being selected from the group consisting air, gas, and a vacuum and separating said acoustic transmission fluid from said atmosphere surrounding said first surface; and positioning a SAM acoustic scanning probe confronting said second surface of said semiconductor device extending into said acoustic transmission fluid. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification